Fabrication Technologies for Advanced Heat Transfer Applications

2003 ◽  
Author(s):  
William J. Grande
Keyword(s):  
Heat Transfer ◽  
Emerging Technologies ◽  
Low Cost ◽  
High Volume ◽  
The Subject ◽  
Active Research ◽  
High Level ◽  
Low Cost Manufacturing ◽  
Conventional Machining ◽  
Microchannel Devices

Microchannel devices with channel widths in the range from one micron to several hundred microns have become increasingly important structures for heat transfer applications. This paper will examine several classes of fabrication technologies that are employed in the field. Established technologies, such as bulk and surface micromachining, high aspect ratio machining, and conventional machining have been perfected over the last several decades and are the principal methods of creating microchannel structures. Synthesizing technologies, such as wafer bonding and micromolding techniques, allow these primary structures to be assembled together into working devices or enable high volume, low cost manufacturing using microstructured masters. Established and synthesizing technologies have reached a high level of performance and are generally the subject of refinement efforts rather than innovative investigations. Active research into new materials, processes, and fabrication strategies are found in the class of emerging technologies. This paper will briefly review the dimensional spectrum of microchannels and survey the established and synthesizing technologies. Then an exploration of emerging technologies will be made. The topic of rapid prototyping will be given particular emphasis.

scholarly journals Advances in Conjugated Polymer Lasers

Polymers ◽  
2019 ◽  
Vol 11 (3) ◽  
pp. 443 ◽  
Author(s):  
Hongyan Xia ◽  
Chang Hu ◽  
Tingkuo Chen ◽  
Dan Hu ◽  
Muru Zhang ◽  
...  
Keyword(s):  
Conjugated Polymers ◽  
Cross Sections ◽  
Conjugated Polymer ◽  
Low Cost ◽  
Research Direction ◽  
Stimulated Emission ◽  
Laser Materials ◽  
Radiation Mechanism ◽  
The Subject ◽  
Low Cost Manufacturing

This paper provides a review of advances in conjugated polymer lasers. High photoluminescence efficiencies and large stimulated emission cross-sections coupled with wavelength tunability and low-cost manufacturing processes make conjugated polymers ideal laser gain materials. In recent years, conjugated polymer lasers have become an attractive research direction in the field of organic lasers and numerous breakthroughs based on conjugated polymer lasers have been made in the last decade. This paper summarizes the recent progress of the subject of laser processes employing conjugated polymers, with a focus on the photoluminescence principle and excitation radiation mechanism of conjugated polymers. Furthermore, the effect of conjugated polymer structures on the laser threshold is discussed. The most common polymer laser materials are also introduced in detail. Apart from photo-pumped conjugated polymer lasers, a direction for the future development of electro-pumped conjugated polymer lasers is proposed.

scholarly journals Emerging Photovoltaics: Organic, Copper Zinc Tin Sulphide, and Perovskite-Based Solar Cells

2016 ◽  
Vol 2016 ◽  
pp. 1-12 ◽  
Author(s):  
Shraavya Rao ◽  
Ankita Morankar ◽  
Himani Verma ◽  
Prerna Goswami
Keyword(s):  
Solar Cells ◽  
Emerging Technologies ◽  
Low Cost ◽  
Environmentally Friendly ◽  
Manufacturing Processes ◽  
Copper Zinc ◽  
Organic Copper ◽  
Low Cost Manufacturing

As the photovoltaics industry continues to grow rapidly, materials other than silicon are being explored. The aim is to develop technologies that use environmentally friendly, abundant materials, low-cost manufacturing processes without compromising on efficiencies and lifetimes. This paper discusses three of the emerging technologies, organic, copper zinc tin sulphide (CZTS), and perovskite-based solar cells, their advantages, and the possible challenges in making these technologies commercially available.

A Novel Precision Die Attach Technique for Opto-Electronics Packaging

2011 ◽  
Author(s):  
V. Bhagavatula ◽  
S. Chaparala ◽  
J. Himmelreich
Keyword(s):  
Laser Diode ◽  
Coefficient Of Thermal Expansion ◽  
Low Cost ◽  
Research Work ◽  
High Volume ◽  
Ceramic Substrates ◽  
Die Attach ◽  
Semiconductor Laser Diodes ◽  
The Cost ◽  
Low Cost Manufacturing

Semiconductor Laser diodes that emit visible light have various interesting applications such as sensing, high density optical storage and projection displays. In any opto-electronic package, the laser diode chips are typically attached or soldered to metal or ceramic substrates that have good thermal conductivity and are well-matched in coefficient of thermal expansion using solder. Some applications require a critical alignment of the front facet of the laser diode to the front edge of the substrate onto which the laser diode chip is attached to. Depending on the application, the alignment precision could be varying from 20 μm to being as stringent as 0.5 to 1 μm. In many of these applications, the cost of packaging is also a very important factor. In such applications, it is essential to develop a laser diode chip bonding process that can meet such stringent die alignments along with a low cost manufacturing process. Therefore, the objective of this research work is to provide a low cost alternative solution for die attach process that can guarantee alignment precision of 0.5 to 1 microns and can be easily adapted to high volume manufacturing. The novel technique proposed in this work uses primarily gravity force for the facet alignments between the two components. In this passive-gravity assisted precision (P-GAP) assembly process, the laser diode (LD) chip is placed on the substrate using a traditional pick and place machine and later the substrate and the chip are tilted such that the chip slides on the substrate due to the gravity and touches a mechanical stop in-front of them. This does not involve any active alignment. In addition, we have provided few ideas to improve the sliding when gravity is used. This technique has been implemented on several samples and the feasibility of achieving the alignment precision to within a micron was demonstrated.

scholarly journals Channelized Substrates Made from BaZr0.75Ce0.05Y0.2O3−d Proton-Conducting Ceramic Polymer Clay

Membranes ◽  
2019 ◽  
Vol 9 (10) ◽  
pp. 130
Author(s):  
Sandrine Ricote ◽  
Benjamin L. Kee ◽  
W. Grover Coors
Keyword(s):  
Low Cost ◽  
Proton Conductor ◽  
High Volume ◽  
Proton Conductors ◽  
Membrane Reactors ◽  
Barium Zirconate ◽  
Separation Membrane ◽  
Complex Architectures ◽  
State Ceramic ◽  
Low Cost Manufacturing

A novel process for producing thick protonic ceramics for use in hydrogen separation membrane reactors is demonstrated. Polymer clay bodies based on polyvinyl acetate (PVA) and mineral oil were formulated, and they permitted parts with complex architectures to be prepared by simple, low-pressure molding in the unfired, “green” state. Ceramic proton conductors based on doped barium zirconate/cerate, made by solid-state reactive sintering, are particularly well-suited for the polymer clay process. In this work, the ceramic proton conductor, BZCY755 (BaZr0.75Ce0.05Y0.2O3−d) was fabricated into a variety of shapes and sizes. Test coupons were produced to confirm that the polymer clay route leads to a high-quality ceramic material suitable for the demanding environment of high-temperature membrane reactors. It has been demonstrated that protonic ceramic specimens with the requisite properties are easily prepared at the laboratory scale. The polymer clay fabrication route opens up the possibility of high-volume, low-cost manufacturing at a commercial scale, by a process similar to how dinnerware and sanitary porcelain are produced today.

scholarly journals Printability of the Screen-Printed Strain Sensor with Carbon Black/Silver Paste for Sensitive Wearable Electronics

2020 ◽  
Vol 10 (19) ◽  
pp. 6983
Author(s):  
Xue Qi ◽  
Heebo Ha ◽  
Byungil Hwang ◽  
Sooman Lim
Keyword(s):  
Carbon Black ◽  
Low Cost ◽  
Strain Sensor ◽  
High Volume ◽  
Gauge Factor ◽  
Wearable Electronics ◽  
Electronic Products ◽  
Consumer Markets ◽  
Wide Range ◽  
Low Cost Manufacturing

Printing technology enables not only high-volume, multipurpose, low-impact, low-cost manufacturing, but also the introduction of flexible electronic devices, such as displays, actuators, and sensors, to a wide range of consumer markets. Consequently, in the past few decades, printed electronic products have attracted considerable interest. Although flexible printed electronic products are attracting increasing attention from the scientific and industrial communities, a systematic study on their sensing performance based on printability has not been reported so far. In this study, carbon black/Ag nanocomposites were utilized as pastes for a flexible wearable strain sensor. The effects of the rheological property of the pastes and the pattern dimensions of the printed electrodes on the sensor’s performance were investigated. Consequently, the printed sensor demonstrated a high gauge factor of 444.5 for an applied strain of 0.6% to 1.4% with a durability of 1000 cycles and a linearity of R2 = 0.9974. The sensor was also stable under tough environmental conditions.

Electrical Through-Hole and Planar Interconnect Generation in Roll-to-Roll LED Lighting Manufacturing using Industrial Inkjet Printheads

2011 ◽  
Vol 1340 ◽  
Author(s):  
Ingo Reinhold ◽  
Moritz Thielen ◽  
Wolfgang Voit ◽  
Werner Zapka ◽  
Reiner Götzen ◽  
...  
Keyword(s):  
High Reliability ◽  
Low Cost ◽  
High Volume ◽  
Led Lighting ◽  
Roll To Roll ◽  
Novel Applications ◽  
Low Cost Manufacturing ◽  
Nanoparticle Ink ◽  
Through Hole ◽  
A Current

ABSTRACTDespite the availability of many high-volume and low-cost manufacturing processes for LED-based lighting applications, relying mainly on fixed patterns such as LED-backlights and RGB-pixelated displays, novel applications, such as “mood lighting” or interior wall displays call for more complicated and shaped LED arrangements. The presented work is based of a novel roll-to-roll (R2R) process to adaptively and cost-efficiently generate LED arrangements on RMPD® substrates.Inkjet printing of planar and though-hole electrical interconnections is of high importance to the process, as it provides a fully digital way of interconnecting devices electrically, accounting for the actual position of the component and spatially provide different ink film thicknesses.Xaar’s industrial inkjet printheads are used to dispense defined volumes of 50 pL of a silver nanoparticle ink in order to provide high reliability and good positioning accuracy while main-taining low satellite drop densities. Specific printing strategies are investigated at a print speed of 0.1 m/s to allow for a reliable electrical connection in case of up to 50 μm deep via connections to the buried component.Due to the low glass-transition nature of the underlying substrates, low sintering tempera-tures are required to preserve the mechanical properties of the substrate. Low temperature oven sintering yielding sufficient conductivity to drive a current of 40 mA will be discussed.

Packaging for medical and wellness applications

2016 ◽  
Vol 2016 (1) ◽  
pp. 000139-000143
Author(s):  
A. Rouzaud ◽  
M. Cartier ◽  
J-C. Souriau ◽  
G. Simon ◽  
J. Brun ◽  
...  
Keyword(s):  
Low Cost ◽  
High Volume ◽  
Building Blocks ◽  
Implantable Devices ◽  
Material Structure ◽  
Portable Devices ◽  
Healthcare Market ◽  
Low Profile ◽  
Global Trend ◽  
Low Cost Manufacturing

Abstract Wellness and medical area are today identified among the next big markets, and the associated roadmaps show a global trend from the benchtop to portable devices then to longer term wearable and implantable devices. For these last devices new packaging technologies need to be developed in order to satisfy both size reduction, important reliability constraints, and moderate/low costs. Two divergent identified markets have been identified:-Consumerist healthcare market associated to high volume and low cost manufacturing,-Professional healthcare market associated to low volume and high cost manufacturing. Based on these findings, we will present in this paper the main new packaging technologies developed at Léti to fit with the constraints of these markets:-In the field of wearable devices: an innovative package designed to be integrated in textiles offering low interaction with material structure and compatible with standard textile tooling and package-winding machines. A specific example of RFID tags will be presented.-In the field of implantable devices: an advanced implantable low profile silicon box for SiP including a MEMS chip and its ASIC. The emphasis will be put on the tests needed to satisfy the different constraints linked to implantability (biostability, biocompatibility).-Lastly, some generic building blocks for soft packaging will be presented, as well as the main trends in their use.

PELAKSANAAN MODEL PEMBELAJARAN KOOPERATIF TIPE STAD UNTUK MENINGKATKAN HASIL BELAJAR PPKn SISWA SMP NEGERI 3 TELUK KUANTAN

2018 ◽  
Vol 2 (5) ◽  
pp. 789
Author(s):  
Maria Yulianti
Keyword(s):  
Cooperative Learning ◽  
Initial Data ◽  
Student Learning ◽  
Learning Outcomes ◽  
Student Learning Outcomes ◽  
Learning Model ◽  
Learning Models ◽  
The Subject ◽  
High Level

The background of this study was the low student learning outcomes of PPKn, from 28 students who achievedthe completeness criteria at least only 11 students (39.29%). The low student learning outcomes are caused bythe high level of individuality between students so that the achievement of competence among studentsexperiences a very distant difference. Based on this, the researchers made improvements to student learningoutcomes through the application of STAD cooperative learning models. This research is a classroom actionresearch, with the subject of class VII of SMP Negeri 3 Teluk Kuantan. The data used in this study is PPKnlearning outcomes data. The results stated that after applying the STAD type cooperative learning model studentlearning outcomes had increased in the initial data the number of students who completed were 11 students, incycle I had an increase with the number of 18 students, and in cycle II the number of students who completedcontinued to increase by the number 22 student.

التغير المناخي واثره في المقنن المائي لمحصول العنب في محافظة ديالى

2019 ◽  
Vol 1 (34) ◽  
pp. 391-422
Author(s):  
اشواق حسن حميد صالح
Keyword(s):  
Climate Change ◽  
Statistical Analysis ◽  
Wind Speed ◽  
Extreme Temperature ◽  
Solar Brightness ◽  
The Subject ◽  
Climate Station ◽  
The Times ◽  
High Level ◽  
Very High

Climate change and its impact on water resources is the problem of the times. Therefore, this study is concerned with the subject of climate change and its impact on the water ration of the grape harvest in Diyala Governorate. The study was based on the data of the Khanaqin climate station for the period 1973-2017, (1986-2017) due to lack of data at governorate level. The general trend of the elements of the climate and its effect on the water formula was extracted. The equation of change was extracted for the duration of the study. The statistical analysis was also used between the elements of the climate (actual brightness, normal temperature, micro and maximum degrees Celsius, wind speed m / s, relative humidity% The results of the statistical analysis confirm that the water ration for the study area is based mainly on the X7 evaporation / netting variable, which is affected by a set of independent variables X1 Solar Brightness X4 X5 Extreme Temperature Wind Speed ​​3X Minimal Temperature and Very High Level .

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