Nmos Logic Circuits in Laser-Crystallized Silicon on Quartz

1983 ◽  
Vol 23 ◽  
Author(s):  
A. Chiang ◽  
M. H. Zarzycki ◽  
W. P. Meuli ◽  
N. M. Johnson
Keyword(s):  
High Performance ◽  
Logic Circuits ◽  
Leakage Currents ◽  
Enhancement Mode ◽  
Low Leakage ◽  
Fused Quartz ◽  
Amorphous Substrates ◽  
Circular Beam ◽  
Processing Steps ◽  
Dynamic Shift

ABSTRACTDepletion mode as well as enhancement mode n-channel thin-film transistors (TFT's) have been fabricated in CO2 laser-crystallized silicon on fused quartz. Nearly defect-free islands were obtained by using an offset circular beam to form a tilted melt interface. The optimization of subsequent processing steps to achieve simultaneously low leakage currents and voltage thresholds appropriate for depletion-load NMOS circuits involved adjustments of ion implantation and high temperature cycles with the aid of simulation. The resultant high performance silicon-gate TFT's have led to NMOS ring oscillators with 2.5 ns delay/stage and dynamic shift registers with MHz clock rates. These are the first logic circuits fabricated in beam-crystallized silicon on bulk amorphous substrates.

Silicon-On-Insulator Mosfets Fabricated in Zone-Melting-Recrystallized Poly-Si Films on SiO2

1981 ◽  
Vol 4 ◽  
Author(s):  
B­Y. Tsaur ◽  
M. W. Gels ◽  
John C. C. Fan ◽  
D. J. Silversmith ◽  
R. W. Mountain
Keyword(s):  
Carrier Mobility ◽  
High Surface ◽  
Zone Melting ◽  
Silicon On Insulator ◽  
Surface Electron ◽  
Leakage Currents ◽  
Si Substrates ◽  
Enhancement Mode ◽  
Low Leakage ◽  
Si Films

ABSTRACTN- and p-channel enhancement-mode MOSFETs have been fabricated in Si films prepared by zone-melting recrystallization of poly-Si deposited on SiO2-coated Si substrates. The transistors exhibit high surface mobilities, in the range of 560–620 cm2/V−s for electrons and 200–240 cm2/V−s for holes, and low leakage currents of the order of 0.1 pA/μm (channel width). Uniform device performance with a yield exceeding 90% has been measured in tests of more than 100 devices. The interface between the Si film and the SiO2 layer on the substrate is characterized by an oxide charge density of 1–2 × 1011 cm−2 and a high surface carrier mobility. N-channel MOSFETs fabricated inSi films recrystallized on SiO2-coated fused quartz subtrates exhibit surface electron mobilities substantially higher than those of single-crystal Si devices because the films are under a large tensile stress.

Structural and Electrical Characterization of Shaped Beam Laser Recrystallized Polysilicon on Amorphous Substrates

1981 ◽  
Vol 4 ◽  
Author(s):  
T. J. Stultz ◽  
J. F. Gibbons
Keyword(s):  
Grain Size ◽  
Electrical Characterization ◽  
Grain Structure ◽  
Electrical Characteristics ◽  
Shaped Beam ◽  
Beam Laser ◽  
Cw Laser ◽  
Amorphous Substrates ◽  
Circular Beam

ABSTRACTStructural and electrical characterization of laser recrystallized LPCVD silicon films on amorphous substrates using a shaped cw laser beam have been performed. In comparing the results to data obtained using a circular beam, it was found that a significant increase in grain size can be achieved and that the surface morphology of the shaped beam recrystallized material was much smoother. It was also found that whereas circular beam recrystallized material has a random grain structure, shaped beam material is highly oriented with a <100> texture. Finally the electrical characteristics of the recrystallized film were very good when measured in directions parallel to the grain boundaries.

Development of high k/III-V (InGaAs, InAs, InSb) structures for future low power, high speed device applications

2013 ◽  
Vol 1538 ◽  
pp. 291-302
Author(s):  
Edward Yi Chang ◽  
Hai-Dang Trinh ◽  
Yueh-Chin Lin ◽  
Hiroshi Iwai ◽  
Yen-Ku Lin
Keyword(s):  
Low Power ◽  
Leakage Current ◽  
High Speed ◽  
High Performance ◽  
Gate Oxide ◽  
Chemical Cleaning ◽  
Low Leakage ◽  
Low Leakage Current ◽  
High K ◽  
Cleaning Methods

ABSTRACTIII-V compounds such as InGaAs, InAs, InSb have great potential for future low power high speed devices (such as MOSFETs, QWFETs, TFETs and NWFETs) application due to their high carrier mobility and drift velocity. The development of good quality high k gate oxide as well as high k/III-V interfaces is prerequisite to realize high performance working devices. Besides, the downscaling of the gate oxide into sub-nanometer while maintaining appropriate low gate leakage current is also needed. The lack of high quality III-V native oxides has obstructed the development of implementing III-V based devices on Si template. In this presentation, we will discuss our efforts to improve high k/III-V interfaces as well as high k oxide quality by using chemical cleaning methods including chemical solutions, precursors and high temperature gas treatments. The electrical properties of high k/InSb, InGaAs, InSb structures and their dependence on the thermal processes are also discussed. Finally, we will present the downscaling of the gate oxide into sub-nanometer scale while maintaining low leakage current and a good high k/III-V interface quality.

Relaxation Behavior and Breakdown Mechanisms of Nanocrystals Embedded Zr-doped HfO2 High-k Thin Films for Nonvolatile Memories

2008 ◽  
Vol 1071 ◽  
Author(s):  
Chia-Han Yang ◽  
Yue Kuo ◽  
Chen-Han Lin ◽  
Rui Wan ◽  
Way Kuo
Keyword(s):  
Nonvolatile Memory ◽  
Storage Capacity ◽  
Breakdown Strength ◽  
Charge Storage ◽  
Leakage Currents ◽  
Low Leakage ◽  
Nonvolatile Memories ◽  
High K ◽  
Memory Characteristics ◽  
Large Charge

AbstractSemiconducting or metallic nanocrystals embedded high-k films have been investigated. They showed promising nonvolatile memory characteristics, such as low leakage currents, large charge storage capacities, and long retention times. Reliability of four different kinds of nanocrystals, i.e., nc- Ru, -ITO, -Si and -ZnO, embedded Zr-doped HfO2 high-k dielectrics have been studied. All of them have higher relaxation currents than the non-embedded high-k film has. The decay rate of the relaxation current is in the order of nc-ZnO > nc-ITO > nc-Si > nc-Ru. When the relaxation currents of the nanocrystals embedded samples were fitted to the Curie-von Schweidler law, the n values were between 0.54 and 0.77, which are much lower than that of the non embedded high-k sample. The nanocrystals retain charges in two different states, i.e., deeply and loosely trapped. The ratio of these two types of charges was estimated. The charge storage capacity and holding strength are strongly influenced by the type of material of the embedded nanocrystals. The nc-ZnO embedded film holds trapped charges longer than other embedded films do. The ramp-relax result indicates that the breakdown of the embedded film came from the breakdown of the bulk high-k film. The type of nanocrystal material influences the breakdown strength.

scholarly journals Crystallization of Bi-substituted iron garnet bi-layers

2021 ◽  
Vol 2086 (1) ◽  
pp. 012044
Author(s):  
T V Mikhailova ◽  
Yu E Vysokikh ◽  
A N Shaposhnikov ◽  
V N Berzhansky ◽  
S Yu Krasnoborodko ◽  
...  
Keyword(s):  
High Performance ◽  
Crystallization Process ◽  
Process Parameter ◽  
Gadolinium Gallium Garnet ◽  
Semiconductor Technology ◽  
Sputtering Deposition ◽  
Fused Quartz ◽  
Iron Garnet ◽  
Substrate Types

Abstract Magneto-optical (MO) structures are widely used for different application in the fields of magnetoplasmonics, magneto-optics, photonics e.t.c. Bi-substituted iron garnet (Bi:IG) is high-performance MO material. Integration of Bi:IG films to silicon semiconductor technology gives new opportunities to create nanoscale hight performance MO devices. Vacuum sputtering deposition allows to fabricate Bi:IG structures on different substrate types. Authors investigate crystallization process of Bi:IG bi-layers in a different process parameter (different layers composition and its thickness, temperature and time of annealing) using gadolinium gallium garnet GGG and fused quartz SiO2 substrates to determine dependences which impact on crystallization.

Dielectric and Ferroelectric studies of Pb0.85La0.15TiO3 Thin Films on solution derived RuO2 Bottom Electrodes

2001 ◽  
Vol 672 ◽  
Author(s):  
S. Bhaskar ◽  
S. B. Majumder ◽  
P. S. Dobal ◽  
S. B. Krupanidhi ◽  
R. S. Katiyar
Keyword(s):  
Thin Films ◽  
Profile Analysis ◽  
Sol Gel ◽  
Dielectric Behavior ◽  
Tangent Loss ◽  
Film Electrode ◽  
Secondary Phases ◽  
Leakage Currents ◽  
Low Leakage ◽  
Electrode Interface

ABSTRACTSol-Gel derived Pb0.85La0.15TiO3 PLT15) thin films were deposited on solution derived RuO2/Si, RuO2/Pt/Si and Pt bottom electrodes. Dielectric, tangent loss, hysteresis, J-E, measurements were also carried out on these films. X-ray results established the single phase perovskite formation with no secondary phases of PLT15 thin film on these electrodes. PLT15 thin films on RuO2 bottom electrode showed relatively inferior ferroelectric and dielectric behavior as compared to Pt electrode. Low leakage currents (10-8 A/cm2 at 10 kV/cm) and the observed J-E characteristics have been attributed to poor film-electrode interface. Observed electrical and dielectric properties have been correlated with the film-electrode interface. The interface characteristics were further augmented by depth profile analysis using Auger Electron Spectroscopy.

Electrical Characteristics of Large Chip-Size 3.3 kV SiC-JBS Diodes

2013 ◽  
Vol 740-742 ◽  
pp. 881-886 ◽  
Author(s):  
Hiroyuki Okino ◽  
Norifumi Kameshiro ◽  
Kumiko Konishi ◽  
Naomi Inada ◽  
Kazuhiro Mochizuki ◽  
...  
Keyword(s):  
Electric Field ◽  
Schottky Barrier ◽  
Leakage Current ◽  
Reverse Current ◽  
Tunneling Current ◽  
Leakage Currents ◽  
Reverse Leakage Current ◽  
Low Leakage ◽  
Chip Size ◽  
Barrier Metal

The reduction of reverse leakage currents was attempted to fabricate 4H-SiC diodes with large current capacity for high voltage applications. Firstly diodes with Schottky metal of titanium (Ti) with active areas of 2.6 mm2 were fabricated to investigate the mechanisms of reverse leakage currents. The reverse current of a Ti Schottky barrier diode (SBD) is well explained by the tunneling current through the Schottky barrier. Then, the effects of Schottky barrier height and electric field on the reverse currents were investigated. The high Schottky barrier metal of nickel (Ni) effectively reduced the reverse leakage current to 2 x 10-3 times that of the Ti SBD. The suppression of the electric field at the Schottky junction by applying a junction barrier Schottky (JBS) structure reduced the reverse leakage current to 10-2 times that of the Ni SBD. JBS structure with high Schottky barrier metal of Ni was applied to fabricate large chip-size SiC diodes and we achieved 30 A- and 75 A-diodes with low leakage current and high breakdown voltage of 4 kV.

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