scholarly journals Towards p-type doping of ZnO by ion implantation

2004 ◽  
Vol 829 ◽  
Author(s):  
V. A. Coleman ◽  
H. H. Tan ◽  
C. Jagadish ◽  
S. O. Kucheyev ◽  
M. R. Phillips ◽  
...  
Keyword(s):  
Ion Implantation ◽  
Damage Accumulation ◽  
High Dose ◽  
Furnace Annealing ◽  
Light Emitting ◽  
Selective Area ◽  
Transmission Electron ◽  
Microelectronics Industry ◽  
P Type ◽  
Temperature Furnace

ABSTRACTZinc oxide is a very attractive material for a range of optoelectronic devices including blue light-emitting diodes and laser diodes. Though n-type doping has been successfully achieved, p-type doing of ZnO is still a challenge that must be overcome before p-n junction devices can be realized. Ion implantation is widely used in the microelectronics industry for selective area doping and device isolation. Understanding damage accumulation and recrystallization processes is important for achieving selective area doping. In this study, As (potential p-type dopant) ion implantation and annealing studies were carried out. ZnO samples were implanted with high dose (1.4 × 1017 ions/cm2) 300 keV As ions at room temperature. Furnace annealing of samples in the range of 900°C to 1200°C was employed to achieve recrystallization of amorphous layers and electrical activation of the dopant. Rutherford backscattering/channeling spectrometry, transmission electron microscopy and cathodolumiescence spectroscopy were used to monitor damage accumulation and annihilation behavior in ZnO. Results of this study have significant implications for p-type doing of ZnO by ion implantation.

TEM study of buried cobalt disilicide layers formed by ion implantation: Identification of cobalt monosilicide inclusions

1990 ◽  
Vol 48 (4) ◽  
pp. 576-577
Author(s):  
A. De Veirman ◽  
J. Van Landuyt ◽  
K.J. Reeson ◽  
R. Gwilliam ◽  
C. Jeynes ◽  
...  
Keyword(s):  
Ion Implantation ◽  
Annealing Treatment ◽  
Silicon On Insulator ◽  
High Dose ◽  
Nitrogen Flow ◽  
Cobalt Disilicide ◽  
Transmission Electron ◽  
Beam Heating ◽  
Co Concentration ◽  
Silicon On Insulator Technology

In analogy to the formation of SIMOX (Separation by IMplanted OXygen) material which is presently the most promising silicon-on-insulator technology, high-dose ion implantation of cobalt in silicon is used to synthesise buried CoSi2 layers. So far, for high-dose ion implantation of Co in Si, only formation of CoSi2 is reported. In this paper it will be shown that CoSi inclusions occur when the stoichiometric Co concentration is exceeded at the peak of the Co distribution. 350 keV Co+ ions are implanted into (001) Si wafers to doses of 2, 4 and 7×l017 per cm2. During the implantation the wafer is kept at ≈ 550°C, using beam heating. The subsequent annealing treatment was performed in a conventional nitrogen flow furnace at 1000°C for 5 to 30 minutes (FA) or in a dual graphite strip annealer where isochronal 5s anneals at temperatures between 800°C and 1200°C (RTA) were performed. The implanted samples have been studied by means of Rutherford Backscattering Spectroscopy (RBS) and cross-section Transmission Electron Microscopy (XTEM).

Formation of Sic, Si3N4 and SiO2 by High-Dose Ion Implantation and Laser Annealing

1980 ◽  
Vol 1 ◽  
Author(s):  
S.W. Chiang ◽  
Y.S. Liu ◽  
R.F. Reihl
Keyword(s):  
Ion Implantation ◽  
Polycrystalline Silicon ◽  
Laser Annealing ◽  
Pulsed Laser ◽  
High Dose ◽  
Pulsed Laser Annealing ◽  
Transmission Electron ◽  
A Cell ◽  
Ft Ir ◽  
Ft Ir Spectroscopy

ABSTRACTHigh-dose ion implantation (1017 ions-cm−2) of C+, N+, and O+ at 50 KeV into silicon followed by pulsed laser annealing at 1.06 μm was studied. Formation of SiC, Si3N4, and SiO2 has been observed and investigated using Transmission Electron Microscopy (TEM) and Differential Fourier-Transform Infrared (FT-IR) Spectroscopy. Furthermore, in N+-implanted and laser-annealed silicon samples, we have observed a cell-like structure which has been identified to be spheroidal polycrystalline silicon formed by the rapid laser irradiation.

scholarly journals Thermal Annealing of High Dose P Implantation in 4H-SiC

2019 ◽  
Vol 963 ◽  
pp. 399-402 ◽  
Author(s):  
Cristiano Calabretta ◽  
Massimo Zimbone ◽  
Eric G. Barbagiovanni ◽  
Simona Boninelli ◽  
Nicolò Piluso ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Raman Spectroscopy ◽  
Ion Implantation ◽  
Epitaxial Layer ◽  
Point Defects ◽  
High Dose ◽  
Double Step ◽  
Post Annealing ◽  
Transmission Electron

In this work, we have studied the crystal defectiveness and doping activation subsequent to ion implantation and post-annealing by using various techniques including photoluminescence (PL), Raman spectroscopy and transmission electron microscopy (TEM). The aim of this work was to test the effectiveness of double step annealing to reduce the density of point defects generated during the annealing of a P implanted 4H-SiC epitaxial layer. The outcome of this work evidences that neither the first 1 hour isochronal annealing at 1650 - 1700 - 1750 °C, nor the second one at 1500 °C for times between 4 hour and 14 hour were able to recover a satisfactory crystallinity of the sample and achieve dopant activations exceeding 1%.

Supersaturated P-Type Polycrystaline Films Produced by Rapid Thermal Annealing of High Dose Boron Ion Implants for Interconnects and Shallow Junction Diffusion Sources

1990 ◽  
Vol 182 ◽  
Author(s):  
B. Raicu ◽  
M.I. Current ◽  
W.A. Keenan ◽  
D. Mordo ◽  
R. Brennan ◽  
...  
Keyword(s):  
Ion Implantation ◽  
Single Crystal ◽  
Thermal Annealing ◽  
Cross Section ◽  
Rapid Thermal Annealing ◽  
Single Crystal Silicon ◽  
High Dose ◽  
Crystal Silicon ◽  
Polysilicon Films ◽  
P Type

AbstractHighly conductive p+-polysilicon films were fabricated over Si(100) and SiO2 surfaces using high-dose ion implantation and rapid thermal annealing. Resistivities close to that of single crystal silicon were achieved. These films were characterized by a variety of electrical and optical techniques as well as SIMS and cross-section TEM.

Porous Amorphous Si Formation by the Etching of Single Crystal Si Substrates

1992 ◽  
Vol 259 ◽  
Author(s):  
T. George ◽  
R. P. Vasquez ◽  
S. S. Kim ◽  
R.W. Fathauer ◽  
W. T. Pike
Keyword(s):  
Photoelectron Spectroscopy ◽  
Light Emitting ◽  
X Ray ◽  
Si Substrates ◽  
Transmission Electron ◽  
Spin Resonance ◽  
Amorphous Si ◽  
Si Films ◽  
P Type ◽  
Stain Etching

ABSTRACTThe nature of light-emitting porous Si layers produced by non-anodic stain etching of p-type (100) Si substrates is studied. The layers were characterized by transmission electron microscopy as being amorphous in nature. X-ray photoelectron spectroscopy and electron spin resonance measurements show these layers to be composed mainly of a-Si. The formation mechanism of the a-Si is explored using by stain etching SiGe ‘marker’ layers within epitaxially grown Si films and by high temperature annealing. These experiments provide strong evidence for a spontaneous crystalline-amorphous phase transformation during the etching process.

scholarly journals Nanoporous Ge thin film production combining Ge sputtering and dopant implantation

2015 ◽  
Vol 6 ◽  
pp. 336-342 ◽  
Author(s):  
Jacques Perrin Toinin ◽  
Alain Portavoce ◽  
Khalid Hoummada ◽  
Michaël Texier ◽  
Maxime Bertoglio ◽  
...  
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Thin Films ◽  
Scanning Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Ion Implantation ◽  
High Dose ◽  
Transmission Electron ◽  
Scanning Electron ◽  
Thin Film Production

In this work a novel process allowing for the production of nanoporous Ge thin films is presented. This process uses the combination of two techniques: Ge sputtering on SiO2 and dopant ion implantation. The process entails four successive steps: (i) Ge sputtering on SiO2, (ii) implantation preannealing, (iii) high-dose dopant implantation, and (iv) implantation postannealing. Scanning electron microscopy and transmission electron microscopy were used to characterize the morphology of the Ge film at different process steps under different postannealing conditions. For the same postannealing conditions, the Ge film topology was shown to be similar for different implantation doses and different dopants. However, the film topology can be controlled by adjusting the postannealing conditions.

Cobalt Contamination in Silicon

2005 ◽  
Vol 108-109 ◽  
pp. 571-576 ◽  
Author(s):  
Maria Luisa Polignano ◽  
Daniele Caputo ◽  
Davide Codegoni ◽  
Vittorio Privitera ◽  
M. Riva
Keyword(s):  
Low Temperature ◽  
Cobalt Concentration ◽  
High Concentration ◽  
Furnace Annealing ◽  
Type Silicon ◽  
P Type ◽  
Temperature Furnace

The properties of cobalt as a contaminant in p-type silicon are studied by using cobaltimplanted wafers annealed by RTP or by RTP plus a low temperature furnace annealing. It is shown that after RTP most cobalt is under the form of CoB pairs. A quantification of cobalt contamination is provided based upon SPV measurements and optical pair dissociation. However, this quantification fails in furnace-annealed wafers because of the formation of a different level. It is shown that the CoB level is located near the band edges, whereas the level formed upon a low temperature furnace annealing is located near midgap. Besides, when the cobalt concentration is high enough a small fraction of cobalt is in a level different from the CoB pair even in RTP samples. This level can probably be identified with a previously observed midgap level. It is suggested that the same level is formed in RTP plus low temperature furnace annealed samples and in high concentration RTP annealed samples, and that this level may consist in some cobalt agglomerate.

A New Application of Rbs-Pixe with High Energy Microbeam

1986 ◽  
Vol 69 ◽  
Author(s):  
B. Raicu ◽  
H. Bakhru ◽  
S. Fesseha ◽  
W. M. Gibson
Keyword(s):  
Ion Implantation ◽  
Transport System ◽  
High Energy ◽  
Silicon Wafers ◽  
High Dose ◽  
Furnace Annealing ◽  
Pixe Analysis ◽  
X Ray ◽  
Technological Factors ◽  
Beam Sputtering

AbstractA beam of 2 MeV He+ ions with a diameter of 2 microns was used to perform Rutherford backscattering (RBS) and particle induced x-ray emission (PIXE) analysis on large residual defects formed by high dose arsenic (As) ion implantation and furnace annealing. Research results concerning contamination in implanted silicon wafers generated by primary beam sputtering, inadequate wafer transport system, and other technological factors are presented.

scholarly journals The microstructure of Si surface layers after plasma-immersion He+ion implantation and subsequent thermal annealing

2017 ◽  
Vol 50 (2) ◽  
pp. 539-546 ◽  
Author(s):  
Andrey Lomov ◽  
Kirill Shcherbachev ◽  
Yurii Chesnokov ◽  
Dmitry Kiselev
Keyword(s):  
High Resolution ◽  
Ion Implantation ◽  
Thermal Annealing ◽  
Structural Changes ◽  
Layer Structure ◽  
Characteristic Size ◽  
High Dose ◽  
X Ray ◽  
P Type ◽  
Subsequent Thermal Annealing

The structural changes in the surface layer of p-type Cz-Si(001) samples after high-dose low-energy (2 keV) He+plasma-immersion ion implantation and subsequent thermal annealing were studied using a set of complementary methods: high-resolution X-ray reflectometry, high-resolution X-ray diffraction, transmission electron microscopy and atomic force microscopy. The formation of a three-layer structure was observed (an amorphous a-SiOxlayer at the surface, an amorphous a-Si layer and a heavily damaged tensile-strained crystalline c-Si layer), which remained after annealing. Helium-filled bubbles were observed in the as-implanted sample. The influence of annealing on the evolution of the three-layer structure and the bubbles is considered. The bubbles are shown to grow after annealing. Their characteristic size is determined to be in the range of 5–20 nm. Large helium-filled bubbles are located in the amorphous a-Si layer. Small bubbles form inside the damaged crystalline Si layer. These bubbles are a major source of tensile strain in the c-Si layer.

Validation of the p-type Behavior of an Ag-doped ZnSe Film Grown Heteroepitaxially on GaAs(100) Substrate

2007 ◽  
Vol 1012 ◽  
Author(s):  
Takashi Narushima ◽  
Hiroaki Yanagita ◽  
Masahiro Orita
Keyword(s):  
Photoelectron Spectroscopy ◽  
Secondary Phases ◽  
X Ray Diffraction ◽  
Light Emitting ◽  
Transmission Electron ◽  
Crystal Films ◽  
Probe Test ◽  
Hot Probe ◽  
P Type ◽  
Znse Single Crystal

AbstractTo validate p-type semiconducting behavior in Ag-doped ZnSe, single-crystal films were grown on GaAs(100) substrates using an evaporation method with ZnSe and Ag2Se powder sources. The heteroepitaxial relationship between ZnSe(100) and GaAs(100) was observed using X-ray diffraction and transmission electron microscopy; secondary phases containing silver or silver selenide were not detected. A film doped with Ag at 1 1020 atm·cm-3 had a conductivity of 1.5 x 10-5 S·cm-1. The hot-probe test indicated p-type polarity, with a clear and reproducible rectifying characteristic demonstrated by forming a ZnSe:Ag/p-GaAs:Zn junction. The work function of a ZnSe:Ag film measured by ultraviolet photoelectron spectroscopy was 6.3 eV. The ZnSe:Ag film is suitable as an injection layer in widegap semiconductor devices and organic light-emitting diodes.

Sign in / Sign up

Export Citation Format

Share Document