scholarly journals Forced stack sleep transistor (FORTRAN): A new leakage current reduction approach in CMOS based circuit designing

2021 ◽  
Vol 34 (2) ◽  
pp. 259-280
Author(s):  
Sankit Kassa ◽  
Neeraj Misra ◽  
Rajendra Nagaria

Reduction in leakage current has become a significant concern in nanotechnology-based low-power, low-voltage, and high-performance VLSI applications. This research article discusses a new low-power circuit design the approach of FORTRAN (FORced stack sleep TRANsistor), which decreases the leakage power efficiency in the CMOS-based circuit outline in VLSI domain. FORTRAN approach reduces leakage current in both active as well as standby modes of operation. Furthermore, it is not time intensive when the circuit goes from active mode to standby mode and vice-versa. To validate the proposed design approach, experiments are conducted in the Tanner EDA tool of mentor graphics bundle on projected circuit designs for the full adder, a chain of 4-inverters, and 4- bit multiplier designs utilizing 180nm, 130nm, and 90nm TSMC technology node. The outcomes obtained show the result of a 95-98% vital reduction in leakage power as well as a 15-20% reduction in dynamic power with a minor increase in delay. The result outcomes are compared for accuracy with the notable design approaches that are accessible for both active and standby modes of operation.

2014 ◽  
Vol 23 (01) ◽  
pp. 1450005 ◽  
Author(s):  
RAGHVENDRA SINGH ◽  
SHYAM AKASHE

In the design of high performance complex arithmetic logic circuits, ground bounce noise, leakage current and leakage power are important and challenging issues in nanometer down scaling. In this paper, the low power and reduced ground bounce noise using 10 transistor full adder has been proposed. Full adder is the most important basic building of digital circuits employing arithmetic operation. Adder circuit is widely used in many digital circuits not only for arithmetic operation but also for address generation in processors and microcontrollers. It is therefore necessary to make these systems more efficient so that they consume less power. Here, we use stacking power gating technique to evaluate leakage current, power and ground bounce noise. This paper describes reduction of leakage power and ground bounce noise from the 10 T full adder circuits to make it more reliable to be used to have low power and stable and errorless output. All the simulation in this paper has been carried out using cadence virtuoso at 45 nm technology at various voltages and various temperatures. By using this technique the leakage current reduction can be improved by 80% and leakage power to 70% as compared to conventional 10 T full adder. Ground bounce noise can be reduced to 60% as compared to the base full adder.


Electronics ◽  
2019 ◽  
Vol 8 (3) ◽  
pp. 312 ◽  
Author(s):  
Woo-Young Choi ◽  
Min-Kwon Yang

The conventional single-phase quasi-Z-source (QZS) inverter has a high leakage current as it is connected to the grid. To address this problem, this paper proposes a transformerless QZS inverter, which can reduce the leakage current for single-phase grid-tied applications. The proposed inverter effectively alleviates the leakage current problem by removing high-frequency components for the common-mode voltage. The operation principle of the proposed inverter is described together with its control strategy. A control scheme is presented for regulating the DC-link voltage and the grid current. A 1.0 kW prototype inverter was designed and tested to verify the performance of the proposed inverter. Silicon carbide (SiC) power devices were applied to the proposed inverter to increase the power efficiency. The experimental results showed that the proposed inverter achieved high performance for leakage current reduction and power efficiency improvement.


2013 ◽  
Vol 12 (02) ◽  
pp. 1350011
Author(s):  
JAYRAM SHRIVAS ◽  
SHYAM AKASHE ◽  
NITESH TIWARI

Optimization of power is a very important issue in low-voltage and low-power application. In this paper, we have proposed power gating technique to reduce leakage current and leakage power of one-bit full adder. In this power gating technique, we use two sleep transistors i.e., PMOS and NMOS. PMOS sleep transistor is inserted between power supply and pull up network. And NMOS sleep transistor is inserted between pull down network and ground terminal. These sleep transistors (PMOS and NMOS) are turned on when the circuit is working in active mode. And sleep transistors (PMOS and NMOS) are turned off when circuit is working in standby mode. We have simulated one-bit full adder and compared with the power gating technique using cadence virtuoso tool in 45 nm technology at 0.7 V at 27°C. By applying this technique, we have reduced leakage current from 2.935 pA to 1.905 pA and leakage power from 25.04μw to 9.233μw. By using this technique, we have reduced leakage power up to 63.12%.


2012 ◽  
Vol 548 ◽  
pp. 885-889 ◽  
Author(s):  
Manisha Pattanaik ◽  
Balwinder Raj ◽  
Shashikant Sharma ◽  
Anjan Kumar

In this paper a high performance diode based trimode Multi-Threshold CMOS (MTCMOS) technique is introduced which minimizes standby leakage current and provides a better way to control the ground bounce noise during sleep to active mode transition using one additional mode i.e. hold mode. Analysis of trimode MTCMOS technique using low power 16-bit full adder has been done for reduction of standby leakage current and ground bounce noise. Further, to evaluate the effectiveness of diode based trimode Multi-Threshold CMOS technique, simulation has been done on low power 16-bit full adder circuit with BPTM 90nm technology at room temperature with supply voltage of 1 V. Diode based trimode Multi-Threshold CMOS technique reduces ground bounce noise by 89.36% and standby leakage current by 19.24% as compared to the standard trimode MTCMOS technique.


2015 ◽  
Vol 14 (05n06) ◽  
pp. 1550022
Author(s):  
Preeti Kushwah ◽  
Saurabh Khandelwal ◽  
Shyam Akashe

The new era of portable electronic devices demands lesser power dissipation for longer battery life and design compactability. Leakage current and leakage power are dominating factors which greatly affect the power consumption in low voltage and low power applications. For many numerical representations of binary numbers, combinational circuits like adder, encoder, multiplexer, etc. are useful circuits for arithmetic operation. A novel high speed and low power half adder cell is introduced here which consists of AND gate and OR gate. This cell shows high speed, lower power consumption than conventional half adder. In CMOS technology, transistors used have small area and low power consumption. It is used in various applications like adder, subtract or, multiplexer, ALU and microprocessors digital VLSI systems. As the scaling technology reduces, the leakage power increases. In this paper, multi threshold complementary metal oxide semiconductor (MTCMOS) technique is proposed to reduce the leakage current and leakage power. MTCMOS is an effective circuit level technique that increases the performance of a cell by using both low- and high-threshold voltage transistors. Leakage current is reduced by 85.37% and leakage power is reduced by 87.45% using MTCMOS technique as compared to standard CMOS technique. The half adder design simulation work was performed by cadence simulation tool at 45-nm technology.


Author(s):  
Sai Venkatramana Prasada G.S ◽  
G. Seshikala ◽  
S. Niranjana

Background: This paper presents the comparative study of power dissipation, delay and power delay product (PDP) of different full adders and multiplier designs. Methods: Full adder is the fundamental operation for any processors, DSP architectures and VLSI systems. Here ten different full adder structures were analyzed for their best performance using a Mentor Graphics tool with 180nm technology. Results: From the analysis result high performance full adder is extracted for further higher level designs. 8T full adder exhibits high speed, low power delay and low power delay product and hence it is considered to construct four different multiplier designs, such as Array multiplier, Baugh Wooley multiplier, Braun multiplier and Wallace Tree multiplier. These different structures of multipliers were designed using 8T full adder and simulated using Mentor Graphics tool in a constant W/L aspect ratio. Conclusion: From the analysis, it is concluded that Wallace Tree multiplier is the high speed multiplier but dissipates comparatively high power. Baugh Wooley multiplier dissipates less power but exhibits more time delay and low PDP.


2005 ◽  
Vol 15 (02) ◽  
pp. 459-476
Author(s):  
C. PATRICK YUE ◽  
JAEJIN PARK ◽  
RUIFENG SUN ◽  
L. RICK CARLEY ◽  
FRANK O'MAHONY

This paper presents the low-power circuit techniques suitable for high-speed digital parallel interfaces each operating at over 10 Gbps. One potential application for such high-performance I/Os is the interface between the channel IC and the magnetic read head in future compact hard disk systems. First, a crosstalk cancellation technique using a novel data encoding scheme is introduced to suppress electromagnetic interference (EMI) generated by the adjacent parallel I/Os . This technique is implemented utilizing a novel 8-4-PAM signaling with a data look-ahead algorithm. The key circuit components in the high-speed interface transceiver including the receive sampler, the phase interpolator, and the transmitter output driver are described in detail. Designed in a 0.13-μm digital CMOS process, the transceiver consumes 310 mW per 10-Gps channel from a I-V supply based on simulation results. Next, a 20-Gbps continuous-time adaptive passive equalizer utilizing on-chip lumped RLC components is described. Passive equalizers offer the advantages of higher bandwidth and lower power consumption compared with conventional designs using active filter. A low-power, continuous-time servo loop is designed to automatically adjust the equalizer frequency response for the optimal gain compensation. The equalizer not only adapts to different channel characteristics, but also accommodates temperature and process variations. Implemented in a 0.25-μm, 1P6M BiCMOS process, the equalizer can compensate up to 20 dB of loss at 10 GHz while only consumes 32 mW from a 2.5-V supply.


2013 ◽  
Vol 1538 ◽  
pp. 291-302
Author(s):  
Edward Yi Chang ◽  
Hai-Dang Trinh ◽  
Yueh-Chin Lin ◽  
Hiroshi Iwai ◽  
Yen-Ku Lin

ABSTRACTIII-V compounds such as InGaAs, InAs, InSb have great potential for future low power high speed devices (such as MOSFETs, QWFETs, TFETs and NWFETs) application due to their high carrier mobility and drift velocity. The development of good quality high k gate oxide as well as high k/III-V interfaces is prerequisite to realize high performance working devices. Besides, the downscaling of the gate oxide into sub-nanometer while maintaining appropriate low gate leakage current is also needed. The lack of high quality III-V native oxides has obstructed the development of implementing III-V based devices on Si template. In this presentation, we will discuss our efforts to improve high k/III-V interfaces as well as high k oxide quality by using chemical cleaning methods including chemical solutions, precursors and high temperature gas treatments. The electrical properties of high k/InSb, InGaAs, InSb structures and their dependence on the thermal processes are also discussed. Finally, we will present the downscaling of the gate oxide into sub-nanometer scale while maintaining low leakage current and a good high k/III-V interface quality.


2012 ◽  
Vol 203 ◽  
pp. 469-473
Author(s):  
Ruei Chang Chen ◽  
Shih Fong Lee

This paper presents the design and implementation of a novel pulse width modulation control class D amplifiers chip. With high-performance, low-voltage, low-power and small area, these circuits are employed in portable electronic systems, such as the low-power circuits, wireless communication and high-frequency circuit systems. This class D chip followed the chip implementation center advanced design flow, and then was fabricated using Taiwan Semiconductor Manufacture Company 0.35-μm 2P4M mixed-signal CMOS process. The chip supply voltage is 3.3 V which can operate at a maximum frequency of 100 MHz. The total power consumption is 2.8307 mW, and the chip area size is 1.1497×1.1497 mm2. Finally, the class D chip was tested and the experimental results are discussed. From the excellent performance of the chip verified that it can be applied to audio amplifiers, low-power circuits, etc.


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