1-3 MeV B+ and P+ Implants for C-Mos Technology

1985 ◽  
Vol 45 ◽  
Author(s):  
J. De Pontcharra ◽  
P. Spinelli ◽  
M. Bruel
Keyword(s):  
Doping Level ◽  
Good Control ◽  
Cmos Technology ◽  
High Energy ◽  
Doping Profile ◽  
Cmos Process ◽  
High Doping Level ◽  
Charged Ions ◽  
Channel Region ◽  
Latch Up

ABSTRACTThe need for low temperature processes in VLSI CMOS technology has led to increasing interest in fully implanted wells. In comparison with diffused wells the advantages are good control of the doping profile, low lateral distribution and self-immunity to latch-up.The technique using a medium energy machine with multiple charged ions is not viable in a production context and only high energy machines can be improved to meet the high throughputs required.We have performed boron and phosphorus in the 1 to 3 MeV range on tandem and Van de Graaff machines to prove their effectiveness. Spreading resistance for boron and phosphorus and SIMS for boron are the characterizatton methods uped. The agreement with expected profiles for doses in the 1013 to 1014 /cm2 range is good. We checked the compatibility with a N-well CMOS process: - low doping level at the surface to ensure low capitances and no disturbance of the channel region - high doping level at one micrometer under the surface to lower punchthrough and latch-up effects. The efficiency of masking materials such as Si02 and photoresists is experimentally measured detecting residual doping underneath various thicknesses of the masking pattern. The application to C-MOS technology is discussed.

scholarly journals Modeling, Simulation Methods and Characterization of Photon Detection Probability in CMOS-SPAD

Sensors ◽  
2021 ◽  
Vol 21 (17) ◽  
pp. 5860
Author(s):  
Aymeric Panglosse ◽  
Philippe Martin-Gonthier ◽  
Olivier Marcelot ◽  
Cédric Virmontois ◽  
Olivier Saint-Pé ◽  
...  
Keyword(s):  
Detection Probability ◽  
Computer Aided Design ◽  
Single Photon ◽  
Complementary Metal Oxide Semiconductor ◽  
Simulation Method ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Doping Profile ◽  
Cmos Process ◽  
Photon Detection

Single-Photon Avalanche Diodes (SPAD) in Complementary Metal-Oxide Semiconductor (CMOS) technology are potential candidates for future “Light Detection and Ranging” (Lidar) space systems. Among the SPAD performance parameters, the Photon Detection Probability (PDP) is one of the principal parameters. Indeed, this parameter is used to evaluate the SPAD sensitivity, which directly affects the laser power or the telescope diameter of space-borne Lidars. In this work, we developed a model and a simulation method to predict accurately the PDP of CMOS SPAD, based on a combination of measurements to acquire the CMOS process doping profile, Technology Computer-Aided Design (TCAD) simulations, and a Matlab routine. We compare our simulation results with a SPAD designed and processed in CMOS 180 nm technology. Our results show good agreement between PDP predictions and measurements, with a mean error around 18.5%, for wavelength between 450 and 950 nm and for a typical range of excess voltages between 15 and 30% of the breakdown voltage. Due to our SPAD architecture, the high field region is not entirely insulated from the substrate, a comparison between simulations performed with and without the substrate contribution indicates that PDP can be simulated without this latter with a moderate loss of precision, around 4.5 percentage points.

scholarly journals Robust and Latch-Up-Immune LVTSCR Device with an Embedded PMOSFET for ESD Protection in a 28-nm CMOS Process

2020 ◽  
Vol 15 (1) ◽  
Author(s):  
Ruibo Chen ◽  
Hongxia Liu ◽  
Wenqiang Song ◽  
Feibo Du ◽  
Hao Zhang ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Low Voltage ◽  
Cmos Technology ◽  
Cmos Process ◽  
Triggering Mechanism ◽  
Esd Protection ◽  
Tcad Simulation ◽  
P Type ◽  
28 Nm ◽  
Latch Up

Abstract Low-voltage-triggered silicon-controlled rectifier (LVTSCR) is expected to provide an electrostatic discharge (ESD) protection for a low-voltage integrated circuit. However, it is normally vulnerable to the latch-up effect due to its extremely low holding voltage. In this paper, a novel LVTSCR embedded with an extra p-type MOSFET called EP-LVTSCR has been proposed and verified in a 28-nm CMOS technology. The proposed device possesses a lower trigger voltage of ~ 6.2 V and a significantly higher holding voltage of ~ 5.5 V with only 23% degradation of the failure current under the transmission line pulse test. It is also shown that the EP-LVTSCR operates with a lower turn-on resistance of ~ 1.8 Ω as well as a reliable leakage current of ~ 1.8 nA measured at 3.63 V, making it suitable for ESD protections in 2.5 V/3.3 V CMOS processes. Moreover, the triggering mechanism and conduction characteristics of the proposed device were explored and demonstrated with TCAD simulation.

Structure of La1.85Sr0.15CuO4 doped with Zn in high doping level

1996 ◽  
Vol 266 (3-4) ◽  
pp. 296-302 ◽  
Author(s):  
X.S. Wu ◽  
S.S. Jiang ◽  
N. Xu ◽  
F.M. Pan ◽  
X.R. Huang ◽  
...  
Keyword(s):  
Doping Level ◽  
High Doping Level

scholarly journals A –5 dBm 400MHz OOK Transmitter for Wireless Medical Application

2014 ◽  
Vol 60 (2) ◽  
pp. 193-198
Author(s):  
M. Yousefi ◽  
D. Koozehkanani ◽  
H. Jangi ◽  
N. Nasirzadeh ◽  
J. Sobhi
Keyword(s):  
Energy Consumption ◽  
Power Amplifier ◽  
High Efficiency ◽  
Medical Application ◽  
Cmos Technology ◽  
High Energy ◽  
Data Rate ◽  
High Data Rate ◽  
Low Power Consumption ◽  
High Data

Abstract A 400 MHz high efficiency transmitter for wireless medical application is presented in this paper. Transmitter architecture with high-energy efficiencies is proposed to achieve high data rate with low power consumption. In the on-off keying transmitters, the oscillator and power amplifier are turned off when the transmitter sends 0 data. The proposed class-e power amplifier has high efficiency for low level output power. The proposed on-off keying transmitter consumes 1.52 mw at -5 dBm output by 40 Mbps data rate and energy consumption 38 pJ/bit. The proposed transmitter has been designed in 0.18μm CMOS technology.

scholarly journals The Impact of Microelectronics on High Energy Physics Innovation: The Role of 65 nm CMOS Technology on New Generation Particle Detectors

2021 ◽  
Vol 9 ◽  
Author(s):  
N. Demaria
Keyword(s):  
Particle Physics ◽  
High Energy Physics ◽  
Hadron Collider ◽  
Cmos Technology ◽  
High Energy ◽  
Main Role ◽  
Noise Power ◽  
Recent Developments ◽  
The Impact ◽  
Energy Physics

The High Luminosity Large Hadron Collider (HL-LHC) at CERN will constitute a new frontier for the particle physics after the year 2027. Experiments will undertake a major upgrade in order to stand this challenge: the use of innovative sensors and electronics will have a main role in this. This paper describes the recent developments in 65 nm CMOS technology for readout ASIC chips in future High Energy Physics (HEP) experiments. These allow unprecedented performance in terms of speed, noise, power consumption and granularity of the tracking detectors.

X-ray diffraction studies on La1.85Sr0.15CuO4 doped with Mg in high doping level

1997 ◽  
Vol 282-287 ◽  
pp. 787-788 ◽  
Author(s):  
X.S. Wu ◽  
Z.Q. Mao ◽  
J. Lin ◽  
W.M. Chen ◽  
X. Jin ◽  
...  
Keyword(s):  
Doping Level ◽  
X Ray Diffraction ◽  
High Doping Level ◽  
X Ray

High Temperature Reliability Investigations up to 350 °C of Gate Oxide Capacitors realized in a Silicon-on-Insulator CMOS-Technology

2013 ◽  
Vol 2013 (HITEN) ◽  
pp. 000116-000121
Author(s):  
K. Grella ◽  
S. Dreiner ◽  
H. Vogt ◽  
U. Paschen
Keyword(s):  
High Temperature ◽  
Dielectric Breakdown ◽  
Gate Oxide ◽  
Oxide Thickness ◽  
Cmos Technology ◽  
Silicon On Insulator ◽  
Cmos Process ◽  
Oxide Breakdown ◽  
Time Dependent Dielectric Breakdown ◽  
Single Poly Eeprom

Standard Bulk-CMOS-technology targets use-temperatures of not more than 175 °C. With Silicon-on-Insulator-technologies (SOI), digital and analog circuitry is possible up to 250 °C and even more, but performance and reliability are strongly affected at these high temperatures. One of the main critical factors is the gate oxide quality and its reliability. In this paper, we present a study of gate oxide capacitor time-dependent dielectric breakdown (TDDB) measurements at temperatures up to 350 °C. The experiments were carried out on gate oxide capacitor structures which were realized in the Fraunhofer 1.0 μm SOI-CMOS process. This technology is based on 200 mm wafers and features, among others, three layers of tungsten metallization with excellent reliability concerning electromigration, voltage independent capacitors, high resistance resistors, and single-poly-EEPROM cells. The gate oxide thickness is 40 nm. Using the data of the TDDB-measurements, the behavior of field and temperature acceleration parameters at temperatures up to 350 °C was evaluated. For a more detailed investigation, the current evolution in time was also studied. An analysis of the oxide breakdown conditions, in particular the field and temperature dependence of the charge to breakdown and the current just before breakdown, completes the study. The presented data provide important information about accelerated oxide reliability testing beyond 250 °C, and make it possible to quickly evaluate the reliability of high temperature CMOS-technologies at use-temperature.

scholarly journals A 350-GHz Coupled Stack Oscillator with −0.8 dBm Output Power in 65-nm Bulk CMOS Process

Electronics ◽  
2020 ◽  
Vol 9 (8) ◽  
pp. 1214
Author(s):  
Thanh Dat Nguyen ◽  
Jong-Phil Hong
Keyword(s):  
Output Power ◽  
Supply Voltage ◽  
Second Harmonic ◽  
Power Level ◽  
Cmos Technology ◽  
Negative Resistance ◽  
Output Power Level ◽  
Cmos Process ◽  
Frequency Selective ◽  
Oscillation Frequencies

This paper presents a push-push coupled stack oscillator that achieves a high output power level at terahertz (THz) wave frequency. The proposed stack oscillator core adopts a frequency selective negative resistance topology to improve negative transconductance at the fundamental frequency and a transformer connected between gate and drain terminals of cross pair transistors to minimize the power loss at the second harmonic frequency. Next, the phases and the oscillation frequencies between the oscillator cores are locked by employing an inductor of frequency selective negative resistance topology. The proposed topology was implemented in a 65-nm bulk CMOS technology. The highest measured output power is −0.8 dBm at 353.2 GHz while dissipating 205 mW from a 2.8 V supply voltage.

scholarly journals Photon-Detection-Probability Simulation Method for CMOS Single-Photon Avalanche Diodes

Sensors ◽  
2020 ◽  
Vol 20 (2) ◽  
pp. 436 ◽  
Author(s):  
Chin-An Hsieh ◽  
Chia-Ming Tsai ◽  
Bing-Yue Tsui ◽  
Bo-Jen Hsiao ◽  
Sheng-Di Lin
Keyword(s):  
Detection Probability ◽  
Single Photon ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Single Photons ◽  
Photon Detection ◽  
Important Indicator ◽  
Avalanche Diodes ◽  
Single Photon Avalanche Diodes

Single-photon avalanche diodes (SPADs) in complementary metal-oxide-semiconductor (CMOS) technology have excellent timing resolution and are capable to detect single photons. The most important indicator for its sensitivity, photon-detection probability (PDP), defines the probability of a successful detection for a single incident photon. To optimize PDP is a cost- and time-consuming task due to the complicated and expensive CMOS process. In this work, we have developed a simulation procedure to predict the PDP without any fitting parameter. With the given process parameters, our method combines the process, the electrical, and the optical simulations in commercially available software and the calculation of breakdown trigger probability. The simulation results have been compared with the experimental data conducted in an 800-nm CMOS technology and obtained a good consistence at the wavelength longer than 600 nm. The possible reasons for the disagreement at the short wavelength have been discussed. Our work provides an effective way to optimize the PDP of a SPAD prior to its fabrication.

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