scholarly journals IMPLEMENTATION OF THE SLIDING MEDIAN METHOD ON FPGA FOR SENSOR SIGNALS PRE-PROCESSING

2021 ◽  
Vol 295 (2) ◽  
pp. 35-39
Author(s):  
I. MANULIAK ◽  
◽  
S. MELNYCHUK ◽  
S. VASCHYSHAK ◽  
S. RUDAK ◽  
...  

The use of modern hardware platforms in the development of computer system components, including digital signal processing, allows to describe circuit solutions using specialized languages such as AlteraHDL, VHDL, Verilog, etc. One of the options for using the resources of programmable logic integrated circuits is to create digital components of signal pre-processing, in particular in information and measurement channels. The application of this approach is due to the presence of various distortions that lead to information and accuracy loss. Another problem is the need to preserve the information performance of such information and measurement channels. It is common to use analog implementations of signal pre-processing methods, in particular different types filters. In this case, the implementation of pre-processing methods at the hardware level will provide the appropriate processing speed at insignificant hardware costs. The paper proposes the implementation of the algorithm for processing information and measurement signals using the sliding median method, implemented on a programmable logic integrated circuit. Based on the simulation in a numerical experiment, the efficiency of using such a method is shown in a relatively simple implementation scheme on the FPGA platform. In fact, the pyramidal scheme of conditional constructions provides a simple description of the logical scheme by means of the Altera HDL language, and also allows to reduce the number of comparison operations. The proposed algorithm does not require complex hardware resources, which allows you to effectively involve typical circuit solutions.

2016 ◽  
Vol 8 (3) ◽  
pp. 321-326
Author(s):  
Tautvydas Brukštus

In this day’s world, more and more focused on data protection. For data protection using cryptographic science. It is also important for the safe storage of passwords for this uses a cryptographic hash function. In this article has been selected the SHA-256 cryptographic hash function to implement and explore, based on fact that it is now a popular and safe. SHA-256 cryptographic function did not find any theoretical gaps or conflict situations. Also SHA-256 cryptographic hash function used cryptographic currencies. Currently cryptographic currency is popular and their value is high. For the measurements have been chosen programmable logic integrated circuits as they less efficiency then ASIC. We chose Altera Corporation produced prog-rammable logic integrated circuits. Counting speed will be investigated by three programmable logic integrated circuit. We will use programmable logic integrated circuits belong to the same family, but different generations. Each programmable logic integrated circuit made using different dimension technology. Choosing these programmable logic integrated circuits: EP3C16, EP4CE115 and 5CSEMA5F31. To compare calculations perfor-mances parameters are provided in the tables and graphs. Research show the calculation speed and stability of different programmable logic circuits. Vis daugiau dėmesio skiriama duomenų apsaugai – duomenų apsaugai skirta net atskira kriptografijos mokslo šaka. Taip pat yra svarbi slaptažodžių sauga, kurioje naudojamos kriptografinės maišos funkcijos. Darbe parinkta įgyvendinimui ir ištirta šiuo metu populiari bei saugi SHA-2 kriptografinė maišos funkcija. Ji naudojama kriptografinėse valiutose. SHA-2 kriptografinės funkcijos analizės metu nepavyko rasti teorinių spragų ar kolizijos atvejų. Tyrimams pasirinkti Altera programuojamos logikos integriniai grandynai, kurie efektyvumu nusileidžia tik specializuotiems integriniams grandynams. Skaičiavimo sparta ir stabilumas buvo tiriama trijuose programuojamos logikos integrinuose grandynuose, priklausančiuose tai pačiai šeimai ir pagamintais skirtingų kartų technologijomis – naudojant 65 nm, 60 nm ir 28 nm KMOP technologijas. Tirtų grandynų kodiniai žymenys EP3C16, EP4CE115 ir 5CSEMA5F31.


Author(s):  
А.А. Пирогов ◽  
Ю.А. Пирогова ◽  
С.А. Гвозденко ◽  
Д.В. Шардаков ◽  
Б.И. Жилин

Цифровая фильтрация распознаваемых сигналов является непременной процедурой при обнаружении и распознавании сообщений. Под фильтрацией понимают любое преобразование сигналов, при котором во входной последовательности обрабатываемых данных целенаправленно изменяются определенные соотношения между различными параметрами сигналов. Системы, избирательно меняющие форму сигналов, устраняющие или уменьшающие помехи, извлекающие из сигналов определенную информацию и т.п., называют фильтрами. Соответственно, фильтры с любым целевым назначением являются частным случаем систем преобразования сигналов. Программируемые логические интегральные схемы (ПЛИС) представляют собой конфигурируемые интегральные схемы, логика работы которых определяется посредством их программирования. Применение ПЛИС для задач цифровой обработки сигналов позволяет получать устройства, способные менять конфигурацию, подстраиваться под определенную задачу за счет их гибко изменяемой, программируемой структуры. При разработке сложных устройств могут применяться в качестве компонентов для проектирования готовые блоки - IP-ядра или сложно-функциональные блоки (СФ-блоки). Использование программных СФ-блоков позволяет наиболее эффективно задействовать их в конечной структуре, в значительной степени сократить затраты на проектирование. Цель работы состоит в построении RTL модели СФ-блока цифровой обработки сигналов, его верификации как на логическом уровне, так и физическом Digital filtering of recognized signals is an indispensable procedure for the detection and recognition of messages. Filtering is understood as any transformation of signals in which certain relationships between different signal parameters are purposefully changed in the input sequence of the processed data. Systems that selectively change the shape of signals, eliminate or reduce interference, extract certain information from the signals, and so on, are called filters. Accordingly, filters with any purpose are a special case of signal conversion systems. Programmable logic integrated circuits (FPGAs) are configurable integrated circuits whose logic is defined through programming. The use of FPGAs for digital signal processing tasks makes it possible to obtain devices capable of changing the configuration, adapting to a specific task due to their flexibly changeable, programmable structure. When developing complex devices, ready-made blocks - IP-cores or complex-functional blocks (SF blocks) - can be used as components for design. The use of software SF-blocks allows them to be used most effectively in the final structure, to a significant extent to reduce design costs. The purpose of the work is to build an RTL model of the SF-block for digital signal processing, its verification both at the logical and physical levels


Author(s):  
S. Khadpe ◽  
R. Faryniak

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.


Author(s):  
N. David Theodore ◽  
Donald Y.C Lie ◽  
J. H. Song ◽  
Peter Crozier

SiGe is being extensively investigated for use in heterojunction bipolar-transistors (HBT) and high-speed integrated circuits. The material offers adjustable bandgaps, improved carrier mobilities over Si homostructures, and compatibility with Si-based integrated-circuit manufacturing. SiGe HBT performance can be improved by increasing the base-doping or by widening the base link-region by ion implantation. A problem that arises however is that implantation can enhance strain-relaxation of SiGe/Si.Furthermore, once misfit or threading dislocations result, the defects can give rise to recombination-generation in depletion regions of semiconductor devices. It is of relevance therefore to study the damage and anneal behavior of implanted SiGe layers. The present study investigates the microstructural behavior of phosphorus implanted pseudomorphic metastable Si0.88Ge0.12 films on silicon, exposed to various anneals.Metastable pseudomorphic Si0.88Ge0.12 films were grown ~265 nm thick on a silicon wafer by molecular-beam epitaxy. Pieces of this wafer were then implanted at room temperature with 100 keV phosphorus ions to a dose of 1.5×1015 cm-2.


1997 ◽  
Vol 473 ◽  
Author(s):  
David R. Clarke

ABSTRACTAs in other engineered structures, fracture occasionally occurs in integrated microelectronic circuits. Fracture can take a number of forms including voiding of metallic interconnect lines, decohesion of interfaces, and stress-induced microcracking of thin films. The characteristic feature that distinguishes such fracture phenomena from similar behaviors in other engineered structures is the length scales involved, typically micron and sub-micron. This length scale necessitates new techniques for measuring mechanical and fracture properties. In this work, we describe non-contact optical techniques for probing strains and a microscopic “decohesion” test for measuring interface fracture resistance in integrated circuits.


2000 ◽  
Vol 631 ◽  
Author(s):  
J. G. Fleming ◽  
E. Chow ◽  
S.-Y. Lin

ABSTRACTResonance Tunneling Diodes (RTDs) are devices that can demonstrate very highspeed operation. Typically they have been fabricated using epitaxial techniques and materials not consistent with standard commercial integrated circuits. We report here the first demonstration of SiO2-Si-SiO2 RTDs. These new structures were fabricated using novel combinations of silicon integrated circuit processes.


Author(s):  
Mark Kimball

Abstract This article presents a novel tool designed to allow circuit node measurements in a radio frequency (RF) integrated circuit. The discussion covers RF circuit problems; provides details on the Radio Probe design, which achieves an input impedance of 50Kohms and an overall attenuation factor of 0 dB; and describes signal to noise issues in the output signal, along with their improvement techniques. This cost-effective solution incorporates features that make it well suited to the task of differential measurement of circuit nodes within an RF IC. The Radio Probe concept offers a number of advantages compared to active probes. It is a single frequency measurement tool, so it complements, rather than replaces, active probes.


Author(s):  
Carl Nail

Abstract To overcome the obstacles in preparing high-precision cross-sections of 'blind' bond wires in integrated circuits, this article proposes a different technique that generates reliable, repeatable cross-sections of bond wires across most or all of their lengths, allowing unencumbered and relatively artifact-free analysis of a given bond wire. The basic method for cross-sectioning a 'blind' bond wire involves radiographic analysis of the sample and metallographic preparation of the sample to the plane of interest. This is followed by tracking the exact location of the plane on the original radiograph using a stereomicroscope and finally darkfield imaging in which the wire is clearly visible with good resolution.


Author(s):  
Nicholas Randall ◽  
Rahul Premachandran Nair

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.


Author(s):  
Fenglei Du ◽  
Greg Bridges ◽  
D.J. Thomson ◽  
Rama R. Goruganthu ◽  
Shawn McBride ◽  
...  

Abstract With the ever-increasing density and performance of integrated circuits, non-invasive, accurate, and high spatial and temporal resolution electric signal measurement instruments hold the key to performing successful diagnostics and failure analysis. Sampled electrostatic force microscopy (EFM) has the potential for such applications. It provides a noninvasive approach to measuring high frequency internal integrated circuit signals. Previous EFMs operate using a repetitive single-pulse sampling approach and are inherently subject to the signal-to-noise ratio (SNR) problems when test pattern duty cycle times become large. In this paper we present an innovative technique that uses groups of pulses to improve the SNR of sampled EFM systems. The approach can easily provide more than an order-ofmagnitude improvement to the SNR. The details of the approach are presented.


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