Cost-effective silver ink for printable and flexible electronics with robust mechanical performance

2019 ◽  
Vol 373 ◽  
pp. 355-364 ◽  
Author(s):  
Kiesar Sideeq Bhat ◽  
Umesh T. Nakate ◽  
Jin-Young Yoo ◽  
Yousheng Wang ◽  
Tahmineh Mahmoudi ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Mechanical Performance ◽  
Cost Effective ◽  
Silver Ink

Electrochemical synthesis of AgNP and mechanical performance of AgNP-EG coatings on soft elastomer

2019 ◽  
Vol 52 (7) ◽  
pp. 609-619
Author(s):  
Murtuza Mehdi ◽  
Maaz Akhtar ◽  
Shahid Abro ◽  
Zahid Qamar ◽  
Malik Muhammad Nauman ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Mechanical Performance ◽  
Cost Effective ◽  
Acetate Solution ◽  
X Ray Diffraction ◽  
Electrically Conductive ◽  
Electrical Failure ◽  
Modern Age ◽  
Scalable Synthesis ◽  
Structural Characterizations

Silver nanoparticles (AgNP) are being used extensively in medical and modern age stretchable and flexible electronics applications. In this article, we describe easy, cost-effective, and scalable synthesis of AgNP using electrolysis of pure silver metal in aqueous silver acetate solution. Size measurements and structural characterizations of the nanoparticles were performed using scanning electron microscopy coupled with image analysis and X-ray diffraction techniques, respectively. As-prepared nanoparticles were dispersed in pure ethylene glycol (EG) in a concentration of 50 wt%. The dispersion was coated on a soft, sticky, stretchable, and flexible elastomeric substrate polydimethylsiloxane (PDMS). Finally, the stretchability and flexibility tests on AgNP-EG/PDMS laminate were performed. The as-fabricated AgNP-EG/PDMS laminate is capable of stretching up to 18% without electrical failure. It was also found to remain electrically conductive when bent on curved surfaces. This behavior indicates that the AgNp-EG/PDMS laminate has good stretchability and flexibility and can be used as an electrically conductive platform for stretchable and flexible electronics.

scholarly journals Mechanical and thermal stability of retained austenite in plastically deformed bainite-based TRIP-aided medium-Mn steels

2021 ◽  
Vol 21 (3) ◽  
Author(s):  
Aleksandra Kozłowska ◽  
Adam Grajcar ◽  
Aleksandra Janik ◽  
Krzysztof Radwański ◽  
Ulrich Krupp ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Thermal Stability ◽  
Retained Austenite ◽  
Elevated Temperatures ◽  
Mechanical Performance ◽  
Mechanical Stability ◽  
Electron Backscatter Diffraction ◽  
Cost Effective ◽  
Tensile Tests ◽  
Thermal Stability Of

AbstractAdvanced medium-Mn sheet steels show an opportunity for the development of cost-effective and light-weight automotive parts with improved safety and optimized environmental performance. These steels utilize the strain-induced martensitic transformation of metastable retained austenite to improve the strength–ductility balance. The improvement of mechanical performance is related to the tailored thermal and mechanical stabilities of retained austenite. The mechanical stability of retained austenite was estimated in static tensile tests over a wide temperature range from 20 °C to 200 °C. The thermal stability of retained austenite during heating at elevated temperatures was assessed by means of dilatometry. The phase composition and microstructure evolution were investigated by means of scanning electron microscopy, electron backscatter diffraction, X-ray diffraction and transmission electron microscopy techniques. It was shown that the retained austenite stability shows a pronounced temperature dependence and is also stimulated by the manganese addition in a 3–5% range.

scholarly journals Accelerated discovery of high-strength aluminum alloys by machine learning

2020 ◽  
Vol 1 (1) ◽  
Author(s):  
Jiaheng Li ◽  
Yingbo Zhang ◽  
Xinyu Cao ◽  
Qi Zeng ◽  
Ye Zhuang ◽  
...  
Keyword(s):  
Machine Learning ◽  
Aluminum Alloys ◽  
Mechanical Performance ◽  
High Strength ◽  
Cost Effective ◽  
Alloy System ◽  
Processing Route ◽  
Specific Strength ◽  
Cu Alloy ◽  
High Strength Aluminum Alloys

Abstract Aluminum alloys are attractive for a number of applications due to their high specific strength, and developing new compositions is a major goal in the structural materials community. Here, we investigate the Al-Zn-Mg-Cu alloy system (7xxx series) by machine learning-based composition and process optimization. The discovered optimized alloy is compositionally lean with a high ultimate tensile strength of 952 MPa and 6.3% elongation following a cost-effective processing route. We find that the Al8Cu4Y phase in wrought 7xxx-T6 alloys exists in the form of a nanoscale network structure along sub-grain boundaries besides the common irregular-shaped particles. Our study demonstrates the feasibility of using machine learning to search for 7xxx alloys with good mechanical performance.

Silver mirror reaction metallized chromatography paper for supercapacitor application

2021 ◽  
Author(s):  
I-Hsuan Chen ◽  
Jung-Hsien Chang ◽  
Ren-Jie Xie ◽  
Chia-Hui Tseng ◽  
Sheng-Rong Hsieh ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Photoelectron Spectroscopy ◽  
Cost Effective ◽  
Water Contact ◽  
X Ray ◽  
Supercapacitor Application ◽  
Resource Limited ◽  
Vis Spectroscopy ◽  
Silver Mirror ◽  
Silver Mirror Reaction

Abstract In this study, the easy-to-operate silver mirror reaction (SMR) was used for metallizing chromatography paper. The SMR-metallized paper was characterized by water contact angle measurements, a surface profiler, X-ray photoelectron spectroscopy, UV-vis spectroscopy, X-ray diffraction, and electrical resistance measurement. The characterization results show that Ag was successfully synthesized on cellulose fibers and was electrically conductive after cyclic bending. Moreover, this SMR-metallized paper was used as electrodes for fabricating a supercapacitor. This SMR-metallized paper could be used for realizing cost-effective flexible electronics applied in on-site biochemical sensing in resource-limited settings.

Preparation and application of water-based nano-silver conductive ink in paper-based 3D printing

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Chenfei Zhao ◽  
Jun Wang ◽  
Lini Lu
Keyword(s):  
Flexible Electronics ◽  
Low Cost ◽  
Methyl Cellulose ◽  
Conductive Ink ◽  
Content Type ◽  
Nano Silver ◽  
Printed Circuit ◽  
Silver Ink ◽  
Sintering Time ◽  
Water Based

Purpose In flexible electronics applications, organic inks are mostly used for inkjet printing. Three-dimensional (3 D) printing technology has the advantages of low cost, high speed and good precision in modern electronic printing. The purpose of this study is to solve the high cost of traditional printing and the pollution emissions of organic ink. It is necessary to develop a water-based conductive ink that is easily degradable and can be 3 D printed. A nano-silver ink printed circuit pattern with high precision, high conductivity and good mechanical properties is a promising strategy. Design/methodology/approach The researched nano-silver conductive ink is mainly composed of silver nanoparticles and resin. The effect of adding methyl cellulose on the ink was also explored. A simple 3 D circuit pattern was printed on photographic paper. The line width, line length, line thickness and conductivity of the printed circuit were tested. The influence of sintering temperature and sintering time on pattern resistivity was studied. The relationship between circuit pattern bending performance and electrical conductivity is analyzed. Findings The experimental results show that the ink has the characteristics of low silver content and good environmental protection effect. The printing feasibility of 3 D printing circuit patterns on paper substrates was confirmed. The best printing temperature is 160°C–180°C, and the best sintering time is 30 min. The circuit pattern can be folded 120°, and the cycle is folded more than 60 times. The minimum resistivity of the circuit pattern is 6.07 µΩ·cm. Methyl cellulose can control the viscosity of the ink. The mechanical properties of the pattern have been improved. The printing method of 3 D printing can significantly reduce the sintering time and temperature of the conductive ink. These findings may provide innovation for the flexible electronics industry and pave the way for alternatives to cost-effective solutions. Originality/value In this study, direct ink writing technology was used to print circuit patterns on paper substrates. This process is simple and convenient and can control the thickness of the ink layer. The ink material is nonpolluting to the environment. Nano-silver ink has suitable viscosity and pH value. It can meet the requirements of pneumatic 3 D printers. The method has the characteristics of simple process, fast forming, low cost and high environmental friendliness.

Performance of All-Polypropylene Composites at LNG Temperatures

2017 ◽  
Author(s):  
Bilim Atli-Veltin
Keyword(s):  
Composite Materials ◽  
Mechanical Performance ◽  
Cost Effective ◽  
Tensile Tests ◽  
Small Scale ◽  
Failure Behavior ◽  
Polypropylene Composites ◽  
Design Flexibility ◽  
Static Tensile ◽  
Interlaminar Shear

In the small scale LNG infrastructure, composite materials are scarcely employed. Potentially, cost effective solutions for LNG applications could be developed thanks to the advantages of composite materials over metals such as weight savings, design flexibility and recyclability. The research presented in this paper focuses on the mechanical performance of fully recyclable, thermoplastic Polypropylene (PP) composite tapes at cryogenic LNG temperatures. Quasi-static tensile tests performed on [±45] laminates made of plain woven plies of PURE® show that at −196°C the behavior is bilinear with the failure strain of 6.5% and failure stress of 37 MPa. Such non-brittle failure behavior of PP is desirable for cryogenic applications. The other results presented in the paper contains [0/90] laminate results and the interlaminar shear strength characteristics at room and cryogenic temperatures.

scholarly journals Utilization of vegetable fibers for production of reinforced cementitious materials

2018 ◽  
Vol 2 ◽  
pp. 145-154 ◽  
Author(s):  
Viviane Costa Correia ◽  
Sergio Francisco Santos ◽  
Holmer Savastano Jr ◽  
Vanderley Moacyr John
Keyword(s):  
Mechanical Performance ◽  
Stress Transfer ◽  
Cost Effective ◽  
Nanofibrillated Cellulose ◽  
Cementitious Materials ◽  
Vegetable Fibers ◽  
The Matrix ◽  
As Stress ◽  
Hybrid Reinforcement ◽  
Cellulosic Pulp

Vegetable fibers produced from agroindustrial resources in the macro, micro and nanometric scales have been used as reinforcement in cementitious materials. The cellulosic pulp, besides being used as the reinforcing element, is also the processing fiber that is responsible for the filtration system in the Hatcheck method. On the other hand, the nanofibrillated cellulose has the advantage of having good mechanical performance and high specific surface, which contributes to improve the adhesion between fiber and matrix. In the hybrid reinforcement, with micro and nanofibers, the cellulose performs bonding elements with the matrix and acts as stress transfer bridges in the micro and nano-cracking network with the corresponding strengthening and toughening of the cementitious composite. Some strategies are studied to mitigate the degradation of the vegetable fibers used in cost-effective and non-conventional fiber cement, as well as to reach a sustainable fiber cement production. As a practical example, the accelerated carbonation curing at early age is a developing technology to increase the durability of composite materials: it decreases porosity, promotes a higher density in the interface generating a good fiber–matrix adhesion and a better mechanical behavior. Thus, the vegetable fibers are potentially applicable to produce high mechanical performance and sustainable cementitious materials for use in the Civil Construction.

scholarly journals Tensile Performance of a Novel Glue-Laminated Cornstalk Scrimber

2020 ◽  
Vol 23 (3) ◽  
pp. 198-203
Author(s):  
Wei Tian ◽  
Yongmei Qian ◽  
Ruozhu Wang ◽  
Yiming Wang
Keyword(s):  
High Pressure ◽  
Tensile Strength ◽  
Experimental Analysis ◽  
Building Material ◽  
Mechanical Performance ◽  
Strain Curve ◽  
Cost Effective ◽  
Building Industry ◽  
Young’S Moduli ◽  
Tensile Performance

Glue-laminated cornstalk scrimber is a novel composite to substitute timber. This composite can be prepared in three steps: selecting flawless cornstalks, laying them parallel to grain, and gluing the scrimbers under high pressure. Compared with ordinary timber, glue-laminated cornstalk scrimber excels in the resistance to water, damping, insect, and fire. It is therefore widely recognized as novel eco-friendly and cost- effective composite with great potential in the building industry. The tensile strength of glue-laminated cornstalk scrimber mainly depends on the parallel-to-grain strength of its fibers. The mechanical performance parallel to grain directly determines that of this composite. Hence, this paper carries out experimental analysis on the Young’s moduli and parallel-to-grain tensile strengths of cornstalk scrimber and glue-laminated cornstalk scrimber. The results show that the load-strain curve of glue-laminated cornstalk scrimber basically changed linearly parallel to grain, and the material exhibited stable Young’s modulus and good strength; the glue-laminated cornstalk scrimber had a slightly higher tensile strength than cornstalk scrimber, and could thus replace timber as a building material.

Screen Printing Fine Pitch Stretchable Silver Inks onto a Flexible Substrate for Wearable Applications

2018 ◽  
Vol 2018 (1) ◽  
pp. 000665-000671
Author(s):  
Jianbiao Pan ◽  
Malcolm Keif ◽  
Joshua Ledgerwood ◽  
Xiaoying Rong ◽  
Xuan Wang
Keyword(s):  
Sheet Resistance ◽  
Flexible Electronics ◽  
Screen Printing ◽  
Flexible Substrate ◽  
Thermoplastic Polyurethane ◽  
Organic Substrate ◽  
Printing Process ◽  
Silver Ink ◽  
Fine Pitch

Abstract The lightweight and bendable features of printed flexible electronics are increasingly attractive. Currently stretchable silver inks are formulated for wide traces, typically larger than 2 mm. To attach ultra-thin silicon chips that have fine pitch onto printed organic substrate, it is necessary to print fine trace width/space that matches the pitch of the chips, which may be less than 200 microns. This paper presents the development and optimization of the screen printing process for printing stretchable silver ink onto stretchable thermoplastic polyurethane (TPU) substrate. A test vehicle was designed including 50 μm/5 mm (line width/line length) to 350 μm/35 mm lines (at 4 biases). The stretchable ink selected was DuPont PE 873 and Dupont's PE 5025 ink (non-stretchable conductive flake silver) was used as a “control” to baseline the printing process. The substrate used was Bemis TPU ST604. The experiment was done on a DEK Horizon 03i printer. A DEK squeegee 200 (Blue) and a DEK 265 flood bar (200 mm) were used. A 2-level factorial design with three replicates was selected to investigate the effect of process parameters on the quality of prints. The quality of the prints is characterized by 1) resistance of traces, 2) sheet resistance, 3) z-axis height, and 4) trace width/spacing. We observed significant noise in the z-axis printed silver ink height measured by profilometry and concluded z-axis height is not a good response variable for characterizing screen printing stretchable silver ink onto TPU substrate, mainly due to high roughness of the TPU substrate. We proposed calculated sheet resistance based on the measured resistance value, trace width, and trace length, which can replace trace height measurements on rough profile substrates. We found that squeegee pressure and emulsion thickness have statistically significant effects on calculated sheet resistance of print traces while print speed does not have statistically significant effects. In our experiment setting levels, the lower the squeegee pressure, the lower the calculated sheet resistance that is achieved. The emulsion with higher emulsion over mesh (EOM) is better than the emulsion with lower EOM since it can achieve lower sheet resistance. After optimizing the screen printing process, we were able to print 100 μm (4 mils) trace width and spacing with high consistency.

scholarly journals One-pot synthesis of a stable and cost-effective silver particle-free ink for inkjet-printed flexible electronics

2020 ◽  
Vol 8 (46) ◽  
pp. 16443-16451
Author(s):  
Wendong Yang ◽  
Florian Mathies ◽  
Eva L. Unger ◽  
Felix Hermerschmidt ◽  
Emil J. W. List-Kratochvil
Keyword(s):  
Flexible Electronics ◽  
Silver Particle ◽  
Low Cost ◽  
Cost Effective ◽  
Good Stability ◽  
Flexible Substrates ◽  
One Pot ◽  
One Pot Synthesis ◽  
Do It Yourself

A do-it-yourself silver particle-free ink is presented, which shows good stability, low cost and excellent printability. The ink is formulated in selected alcohols. Highly conductive silver patterns were printed on both glass and flexible substrates.

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