Nanoscale hybrid manufacturing process by nano particle deposition system (NPDS) and focused ion beam (FIB)

CIRP Annals ◽  
2011 ◽  
Vol 60 (1) ◽  
pp. 583-586 ◽  
Author(s):  
S.H. Ahn ◽  
D.M. Chun ◽  
C.S. Kim
Keyword(s):  
Manufacturing Process ◽  
Particle Deposition ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Hybrid Manufacturing ◽  
Nano Particle

In-Situ Characterization of Nano-Structures Fabricated by Focused Ion Beam (FIB) and Nano Particle Deposition System (NPDS)

2014 ◽  
Author(s):  
Hyun-Taek Lee ◽  
Chung-Soo Kim ◽  
Hae-Sung Yoon ◽  
Ki-Hwan Jang ◽  
Jung-Oh Choi ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Mechanical Property ◽  
Particle Deposition ◽  
Focused Ion Beam ◽  
Bulk Material ◽  
Ion Beam ◽  
Test Method ◽  
Nano Particle ◽  
Nano Structures

Nano particle deposition system (NPDS) had been developed for the creation of micro/nano structures with multimaterials in order to develop the micro/nano devices on the basis of specific localized surface on the multilayer. However, micro structures fabricated by NPDS show different mechanical properties when it compared to bulk material because of its porous and uneven deposition structure. To achieve reasonable mechanical properties of the structure fabricated by nanoscale 3D printing system, it requires in-situ mechanical property test method. Herein, a new approach for in-situ nanomechanical characterization system using microforce sensor and nanomanipulator installed in focused ion beam system. In this research, experimental setup for mechanical characterization was developed and mechanical property test was done in Focused Ion Beam (FIB) system. The specimen was fabricated by FIB milling process, then manipulation and compression processes are operated by this characterization system with real time imaging. The test was done for silver microstructures fabricated by NPDS and results show weaker hardness and smaller young’s modulus than bulk material.

A New Assembling Method for Nano-sized Particles Using an Electrified Pattern Drawn by a Focused Ion Beam

2000 ◽  
Vol 636 ◽  
Author(s):  
Hiroshi Fudouzi ◽  
Mikihiko Kobayashi ◽  
Norio Shinya
Keyword(s):  
Particle Deposition ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Colloidal Suspension ◽  
Self Assembled Monolayer ◽  
Nano Structures ◽  
Aerosol Process ◽  
Suspension Process ◽  
Potential Applications ◽  
A New Technique

AbstractThis paper describes a new technique to fabricate two-dimensional microstructures assembled with nano-sized particles. The nano-sized particles attract a lot of attention because of their unique properties compared to bulk materials. Micro- and nano- structures assembled with nano-sized particles have potential applications in electronic, optical and biochemical fields. The Self-Assembled Monolayer (SAM) film patterning is one of the methods to assemble the nano-sized particles. We have proposed a new method to assemble nano-sized particles on a substrate using an electric field generated by an electrified pattern. In this study, following our methods titanium oxide (TiO2, diam.=21nm) particles were patterned on an n-type (100) silicon substrate having an oxidized layer. The particle deposition on the substrates was carried out using a colloidal suspension process and an aerosol process.

Nanocomposite Polyurethane Foams Via POSS Blends

2002 ◽  
Vol 733 ◽  
Author(s):  
Brock McCabe ◽  
Steven Nutt ◽  
Brent Viers ◽  
Tim Haddad
Keyword(s):  
High Temperature ◽  
Sample Preparation ◽  
Room Temperature ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Polyurethane Foams ◽  
Development Projects ◽  
Polymer Systems ◽  
Polyurethane Resin ◽  
Military Development

AbstractPolyhedral Oligomeric Silsequioxane molecules have been incorporated into a commercial polyurethane formulation to produce nanocomposite polyurethane foam. This tiny POSS silica molecule has been used successfully to enhance the performance of polymer systems using co-polymerization and blend strategies. In our investigation, we chose a high-temperature MDI Polyurethane resin foam currently used in military development projects. For the nanofiller, or “blend”, Cp7T7(OH)3 POSS was chosen. Structural characterization was accomplished by TEM and SEM to determine POSS dispersion and cell morphology, respectively. Thermal behavior was investigated by TGA. Two methods of TEM sample preparation were employed, Focused Ion Beam and Ultramicrotomy (room temperature).

An Study of Influence of Imperfections on the Delamination of Diamond-Like Carbon Films

2002 ◽  
Vol 719 ◽  
Author(s):  
Myoung-Woon Moon ◽  
Kyang-Ryel Lee ◽  
Jin-Won Chung ◽  
Kyu Hwan Oh
Keyword(s):  
Cross Sections ◽  
Focused Ion Beam ◽  
Imaging System ◽  
Ion Beam ◽  
Carbon Films ◽  
Diamond Like Carbon ◽  
Glass Substrates ◽  
Atomic Force ◽  
Initiation And Propagation

AbstractThe role of imperfections on the initiation and propagation of interface delaminations in compressed thin films has been analyzed using experiments with diamond-like carbon (DLC) films deposited onto glass substrates. The surface topologies and interface separations have been characterized by using the Atomic Force Microscope (AFM) and the Focused Ion Beam (FIB) imaging system. The lengths and amplitudes of numerous imperfections have been measured by AFM and the interface separations characterized on cross sections made with the FIB. Chemical analysis of several sites, performed using Auger Electron Spectroscopy (AES), has revealed the origin of the imperfections. The incidence of buckles has been correlated with the imperfection length.

Low Energy Ar Ion Milling of FIB TEM Specimens from 14 nm and Future FinFET Technologies

2018 ◽  
Author(s):  
C.S. Bonifacio ◽  
P. Nowakowski ◽  
M.J. Campin ◽  
M.L. Ray ◽  
P.E. Fischione
Keyword(s):  
Field Effect Transistor ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Specimen Preparation ◽  
Ion Milling ◽  
Transmission Electron ◽  
High Resolution Tem ◽  
Effect Transistor ◽  
20 Nm ◽  
Argon Ion

Abstract Transmission electron microscopy (TEM) specimens are typically prepared using the focused ion beam (FIB) due to its site specificity, and fast and accurate thinning capabilities. However, TEM and high-resolution TEM (HRTEM) analysis may be limited due to the resulting FIB-induced artifacts. This work identifies FIB artifacts and presents the use of argon ion milling for the removal of FIB-induced damage for reproducible TEM specimen preparation of current and future fin field effect transistor (FinFET) technologies. Subsequently, high-quality and electron-transparent TEM specimens of less than 20 nm are obtained.

Automated Diagonal Slice and View Solution for 3D Device Structure Analysis

2018 ◽  
Author(s):  
Sang Hoon Lee ◽  
Jeff Blackwood ◽  
Stacey Stone ◽  
Michael Schmidt ◽  
Mark Williamson ◽  
...  
Keyword(s):  
Cross Section ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Image Data ◽  
Planar Surface ◽  
Device Structure ◽  
Cross Sectional ◽  
Device Structures ◽  
The Cross ◽  
Planar Analysis

Abstract The cross-sectional and planar analysis of current generation 3D device structures can be analyzed using a single Focused Ion Beam (FIB) mill. This is achieved using a diagonal milling technique that exposes a multilayer planar surface as well as the cross-section. this provides image data allowing for an efficient method to monitor the fabrication process and find device design errors. This process saves tremendous sample-to-data time, decreasing it from days to hours while still providing precise defect and structure data.

Novel Approach of Improving Secondary Electron Detector in FIB System

2018 ◽  
Author(s):  
Steve Wang ◽  
Jim McGinn ◽  
Peter Tvarozek ◽  
Amir Weiss
Keyword(s):  
Integrated Circuit ◽  
Secondary Electron ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Vital Role ◽  
Electron Detector ◽  
System A ◽  
Novel Approach

Abstract Secondary electron detector (SED) plays a vital role in a focused ion beam (FIB) system. A successful circuit edit requires a good effective detector. Novel approach is presented in this paper to improve the performance of such a detector, making circuit altering for the most advanced integrated circuit (IC) possible.

Electrical Characterization of Different Failure Modes in Sub-100 nm Devices Using Nanoprobing Technique

2009 ◽  
Author(s):  
E. Hendarto ◽  
S.L. Toh ◽  
J. Sudijono ◽  
P.K. Tan ◽  
H. Tan ◽  
...  
Keyword(s):  
Electron Microscope ◽  
Focused Ion Beam ◽  
Failure Modes ◽  
Ion Beam ◽  
Electrical Characterization ◽  
Nickel Silicide ◽  
Fault Isolation ◽  
Technology Nodes ◽  
Scanning Electron

Abstract The scanning electron microscope (SEM) based nanoprobing technique has established itself as an indispensable failure analysis (FA) technique as technology nodes continue to shrink according to Moore's Law. Although it has its share of disadvantages, SEM-based nanoprobing is often preferred because of its advantages over other FA techniques such as focused ion beam in fault isolation. This paper presents the effectiveness of the nanoprobing technique in isolating nanoscale defects in three different cases in sub-100 nm devices: soft-fail defect caused by asymmetrical nickel silicide (NiSi) formation, hard-fail defect caused by abnormal NiSi formation leading to contact-poly short, and isolation of resistive contact in a large electrical test structure. Results suggest that the SEM based nanoprobing technique is particularly useful in identifying causes of soft-fails and plays a very important role in investigating the cause of hard-fails and improving device yield.

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