scholarly journals Nanowires of Lead-Free Solder Alloy SnCuAg

2011 ◽  
Vol 2011 ◽  
pp. 1-6 ◽  
Author(s):  
F. E. Atalay ◽  
D. Avsar ◽  
H. Kaya ◽  
V. Yagmur ◽  
S. Atalay ◽  
...  
Keyword(s):  
Deposition Time ◽  
Deposition Process ◽  
Deposition Potential ◽  
Ion Content ◽  
Scanning Calorimetry ◽  
Anodic Alumina Oxide ◽  
Alumina Oxide ◽  
Alloy Nanowires ◽  
Free Solder ◽  
Ordered Porous

Ternary Sn88Ag5Cu7, Sn93Ag4Cu3, Sn58Ag18Cu24, Sn78Ag16Cu6, Sn90Ag4Cu6, Sn87Ag4Cu9alloy nanowires were produced at various values of deposition potential by dc electrodeposition on highly ordered porous anodic alumina oxide (AAO) templates. During the deposition process some parameters, such as ion content, deposition time, pH, and temperature of the solution, were kept constant. The diameter and length of regular Sn93Ag4Cu3nanowires electrodeposited at −1 V were determined by scanning electron microscopy (SEM) to be approximately 200–250 nm and 7-8 μm, respectively. Differential scanning calorimetry (DSC) results indicate that the melting onset temperature of Sn93Ag4Cu3nanowires is about 204°C.

Effect of Current Density and Temperature on Template Assisted Cobalt Nanowire

2019 ◽  
Author(s):  
Ali Imran Shiave ◽  
Ram Mohan ◽  
Mahendran Samykano
Keyword(s):  
Current Density ◽  
Growth Parameters ◽  
Deposition Process ◽  
Xrd Analysis ◽  
High Yield ◽  
Free Standing ◽  
Cobalt Nanowires ◽  
Anodic Alumina Oxide ◽  
Industry Applications ◽  
Alumina Oxide

Abstract Metal 1-D nanostructures are of special interest in industry applications because of their unique properties. Various synthesizing techniques have been employed to grow free standing and well dispersed nanowires. Among these methods, template assisted electrodeposition (TAE) is the most popular one because of its simplicity, cost effectiveness, high yield, ease of control over growth parameters, less contamination, and scalability to mass production. Processing conditions during the deposition process can affect the nanowire properties by a great deal. So far, these effects are not well established, and are in the early stages. In this work, we study the effect of current density and temperature on electrodeposited cobalt (Co) nanowire synthesized via template-assisted approach. Commercially available anodic alumina oxide templates were used for galvanostatic two electrode electrodeposition. Scanning electron microscopy was used to study the morphology of formed cobalt nanowires with EDS analysis confirming Co as main building element. Detailed XRD analysis was performed to find crystal orientation as well as crystal size.

scholarly journals Preparation and Properties of Mo Coating on H13 Steel by Electro Spark Deposition Process

Materials ◽  
2021 ◽  
Vol 14 (13) ◽  
pp. 3700
Author(s):  
Wenquan Wang ◽  
Ming Du ◽  
Xinge Zhang ◽  
Chengqun Luan ◽  
Yingtao Tian
Keyword(s):  
Corrosion Resistance ◽  
Service Life ◽  
Deposition Time ◽  
Deposition Process ◽  
H13 Steel ◽  
Carbide Phases ◽  
Metallurgical Bonding ◽  
Wear And Corrosion ◽  
Deposition Power ◽  
Wear And Corrosion Resistance

H13 steel is often damaged by wear, erosion, and thermal fatigue. It is one of the essential methods to improve the service life of H13 steel by preparing a coating on it. Due to the advantages of high melting point, good wear, and corrosion resistance of Mo, Mo coating was fabricated on H13 steel by electro spark deposition (ESD) process in this study. The influences of the depositing parameters (deposition power, discharge frequency, and specific deposition time) on the roughness of the coating, thickness, and properties were investigated in detail. The optimized depositing parameters were obtained by comparing roughness, thickness, and crack performance of the coating. The results show that the cross-section of the coating mainly consisted of strengthening zone and transition zone. Metallurgical bonding was formed between the coating and substrate. The Mo coating mainly consisted of Fe9.7Mo0.3, Fe-Cr, FeMo, and Fe2Mo cemented carbide phases, and an amorphous phase. The Mo coating had better microhardness, wear, and corrosion resistance than substrate, which could significantly improve the service life of the H13 steel.

Effects on the microstructure and mechanical properties of Sn-0.7Cu lead-free solder with the addition of a small amount of magnesium

2016 ◽  
Vol 23 (6) ◽  
pp. 641-647
Author(s):  
Her-Yueh Huang ◽  
Chung-Wei Yang ◽  
Yu-Chang Peng
Keyword(s):  
Mechanical Properties ◽  
Aging Process ◽  
Intermetallic Layer ◽  
Eutectic Structure ◽  
Contact Angles ◽  
Solidification Structure ◽  
Lead Free Solder ◽  
Bulk Alloy ◽  
Scanning Calorimetry ◽  
Free Solder

AbstractThe influence of a small amount of magnesium (only 0.01 wt.%) added to the Sn-0.7Cu solder alloy during the aging process of microstructural evolution is studied along with the mechanical properties of the alloy. The experimental results indicate that the addition of magnesium decreases the tensile strength of the solders but improves their elongation. The solidification structure of eutectic Sn-0.7Cu consists of β-Sn, and the eutectic structure, which has extremely fine intermetallic nodules, Cu6Sn5, is located in the interdendritic region. When the magnesium is added to the Sn-0.7Cu alloy, the Sn dendrites become slightly coarser; in comparison, the melting point of the Sn-0.7Cu-0.01Mg alloy decreased by 2°C for the differential scanning calorimetry results of bulk alloy samples. Sn-0.7Cu-0.01Mg exhibits the lowest contact angles and the widest spreading areas. After aging, the Sn-0.7Cu and Sn-0.7Cu-0.01Mg solders show significant changes in strength, mainly because of the obvious increase in the thickness of the Cu6Sn5 intermetallic layer.

scholarly journals Deposition Time induced Structural and Optical Properties of Lead Tin Sulphide Thin Films

2021 ◽  
pp. 455-458
Author(s):  
J. Damisa ◽  
J. O. Emegha ◽  
I. L. Ikhioya
Keyword(s):  
Thin Films ◽  
Refractive Index ◽  
Optical Properties ◽  
Absorption Coefficient ◽  
Tin Oxide ◽  
Deposition Time ◽  
Deposition Process ◽  
Structural And Optical Properties ◽  
X Ray ◽  
Prepared Material

Lead tin sulphide (Pb-Sn-S) thin films (TFs) were deposited on fluorine-doped tin oxide (FTO) substrates via the electrochemical deposition process using lead (II) nitrate [Pb(NO3)2], tin (II) chloride dehydrate [SnCl2.2H2O] and thiacetamide [C2H5NS] precursors as sources of lead (Pb), tin (Sn) and sulphur (S). The solution of all the compounds was harmonized with a stirrer (magnetic) at 300k. In this study, we reported on the improvements in the properties (structural and optical) of Pb-Sn-S TFs by varying the deposition time. We observed from X-ray diffractometer (XRD) that the prepared material is polycrystalline in nature. UV-Vis measurements were done for the optical characterizations and the band gap values were seen to be increasing from 1.52 to 1.54 eV with deposition time. In addition to this, the absorption coefficient and refractive index were also estimated and discussed.

How Electrophoretic Deposition with Ligand-Free Platinum Nanoparticles Affects Contact Angle

2015 ◽  
Vol 654 ◽  
pp. 218-223 ◽  
Author(s):  
Alexander Heinemann ◽  
Sven Koenen ◽  
Kerstin Schwabe ◽  
Christoph Rehbock ◽  
Stephan Barcikowski
Keyword(s):  
Contact Angle ◽  
Electrophoretic Deposition ◽  
Platinum Nanoparticles ◽  
Deposition Time ◽  
Deposition Process ◽  
Angle Measurements ◽  
Contact Angle Measurements ◽  
Ligand Free ◽  
Vital Parameters ◽  
Scanning Electron

Electrophoretic deposition of ligand-free platinum nanoparticles has been studied to elucidate how wettability, indicated by contact angle measurements, is linked to vital parameters of the electrophoretic deposition process. These parameters, namely the colloid concentration, electric field strength and deposition time, have been systematically varied in order to determine their influence on the contact angle. Additionally, scanning electron microscopy has been used to confirm the homogeneity of the achieved coatings.

Effects of In and Sb addition on the thermal and wetting behavior of Sn-3.5Ag solder

2018 ◽  
Vol 30 (4) ◽  
pp. 233-240 ◽  
Author(s):  
Md Hasnine
Keyword(s):  
Differential Scanning Calorimetry ◽  
Melting Point ◽  
Thermal Behavior ◽  
Surface Finish ◽  
Design Methodology ◽  
Solder Alloys ◽  
Scanning Calorimetry ◽  
Content Type ◽  
Cu Substrate ◽  
Free Solder

Purpose This paper aims to investigate the effect of In and Sb additions on the thermal behavior and wettability of Sn-3.5Ag-xIn-ySb (x = 0, 1.0 and 1.5 Wt.%, y = 0, 1.0, 1.4 and 2.1 Wt.%) solder alloys. Design/methodology/approach The thermal behavior of the Pb-free solder alloys was studied using differential scanning calorimetry. Wetting balance experiments were performed in accordance with the IPC standard, IPC-TM-650 and at a temperature of 260°C. Also, a solder spread test was performed on a Cu surface finish using the JIS-Z-3197 solderability standard. Findings It is shown that among the selected Sn-3.5Ag-xIn-ySb (x = 0, 1.0 and 1.5 Wt.%, y = 0, 1.0, 1.4 and 2.1 Wt.%) alloys, Sn-3.5Ag-1.5In-1Sb showed the lowest melting point and the lowest undercooling temperature. The best wettability was achieved when the In and Sb contents were approximately 1.5 and 1.0 Wt.%, respectively. The effect of the combined addition of In and Sb on solder spreadability on a Cu substrate was also demonstrated. Originality/value It was found that adding approximately 1.5 and 1.0 Wt.% of In and Sb, respectively, in Sn-3.5Ag solder provided the best wetting performance and improved the solder spreadability.

Consumable Anode Process for SnAg Electroplating

2014 ◽  
Vol 2014 (1) ◽  
pp. 000117-000121
Author(s):  
Marvin Bernt ◽  
Adam McClure
Keyword(s):  
Inert Anode ◽  
Alloy System ◽  
Deposition Potential ◽  
Wafer Level ◽  
Plating Bath ◽  
Wafer Level Packaging ◽  
Free Solder ◽  
Semiconductor Packaging ◽  
Sn Anode ◽  
Liquid Concentrate

Near eutectic tin-silver (SnAg) is currently the alloy of choice for electroplated lead-free solder bumping and Cu pillar capping. While lead-tin (PbSn) is still used in some applications, there has been considerable momentum in moving away from the use of lead in semiconductor packaging. Both solders are normally electroplated as alloys with specific compositions to target a desired melting point. Since the deposition potentials of lead and tin are very close together, they plate with similar characteristics. This makes it possible for PbSn plating systems to use a consumable anode system where the anode composition matches the desired deposit composition. Metals are replenished into the bath in much the same ratio they are consumed. In a SnAg plating bath, the deposition potential of Ag is much more positive than Sn, so very low potential is required for Ag deposition. The plating rate of Ag is generally mass transfer limited. The plating rate of Sn is current controlled. While similar in concept to systems using consumable anodes for plating other metals, the SnAg alloy system presents some unique challenges. Because it is more noble, the Ag+ will deposit onto the Sn anode material by displacement reaction, and passivation will occur. Thus, the Sn anodes cannot come in contact with the Ag+ in the bath. Historically this problem is overcome by using an inert anode and metals replenishment by liquid concentrate. This paper outlines a method for plating SnAg using a consumable Sn anode, thereby reducing cost of ownership (CoO) and increasing bath stability compared to conventional SnAg wafer level packaging (WLP) plating.

Electrodeposited Iron(III) Oxide (α-Fe2O3) Thermoelectric Thin Films

2016 ◽  
Vol 701 ◽  
pp. 23-27 ◽  
Author(s):  
Mohd Zuhri Shaiful Azni ◽  
Ho Kee Tan ◽  
Pei Ling Low ◽  
Nisha Kumari Devaraj ◽  
Boon Hoong Ong ◽  
...  
Keyword(s):  
Thin Films ◽  
Electrical Conductivity ◽  
Deposition Time ◽  
Deposition Potential ◽  
Electrical Conductivities ◽  
Potentiostatic Electrodeposition ◽  
Layered Growth ◽  
Time Parameters ◽  
Thermoelectric Thin Films ◽  
Deposited Films

α-Fe2O3 thermoelectric thin films were electrodeposited onto copper substrates using chloride-based electrolytes by means of potentiostatic electrodeposition. The influence of several electrodeposition parameters on the surface morphology, elemental composition and electrical conductivity of the deposited films was studied and analyzed. The deposits formed porous, wire-like morphology, with the smallest width measured to be ~60 nm. The wires tend to aggregate to form clusters, in addition to multi-layered growth of the wires. Between the parameters studied, electrolyte concentration and deposition time parameters have higher influences on the electrical conductivity of the deposited films, with the increment up to two fold higher. Deposition potential parameter offered the lowest capability to improve on the electrical conductivity in addition to the non-uniform distribution of the measured electrical conductivities. The tunable electrical conductivity is favorable for improving the performance of α-Fe2O3 films for thermoelectric applications.

Magnetron Sputtering Deposition of Calcium Phosphate Films with Nanoscale Grain Morphology in their Surface

2006 ◽  
Vol 975 ◽  
Author(s):  
Wilfredo Otaño ◽  
Víctor M. Pantojas ◽  
Juan M. Figueroa ◽  
Darimar Hernández ◽  
Alejandro Rodríguez-Navarro
Keyword(s):  
Calcium Phosphate ◽  
Surface Morphology ◽  
Magnetron Sputtering ◽  
Deposition Time ◽  
Grain Morphology ◽  
Average Diameter ◽  
Deposition Process ◽  
Medical Implants ◽  
Sputtering Deposition ◽  
Coated Implant

ABSTRACTHydroxyapatite (HA) is a calcium phosphate mineral analogous to the mineral part of bone. This similarity makes this material bioactive and suitable to coat medical implants. However, at present, there is not a coating technique which gives the coated implant the desired properties and long life required for medical implants.In an effort to produce HA coatings with improved properties, calcium phosphate films were prepared using magnetron sputtering deposition on a silicon substrate at 600°C. Initial efforts resulted in the deposition of amorphous films with a distinctive grain-like surface morphology. The morphological grain size was studied using SEM and found that it was possible to control the average diameter value of the round shaped grains by adjusting the deposition time. Increasing the deposition time increases the mean grain diameter. EDS spectra showed the unintentional addition of carbon, iron and nickel to the samples during deposition. After eliminating the impurities, it was possible to prepare calcium phosphate films in the HA phase but without the grain-like surface morphology. These results suggested that the impurities prevented the formation of the calcium phosphate HA phase while acting as nuclei for the heterogeneous nucleation of the grains. This is an important result where the deposition process parameters can be controlled to functionalize the films in order to produce distinctive nanoscale features in the surface morphology.

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