Advanced FIB Application—Automated, Precision Deprocessing for Failure Analysis
Keyword(s):
Ion Beam
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Abstract Focused Ion Beam is widely used in semiconductor industry for critical applications such as TEM sample preparation and circuit edit. In this paper, we introduce an automated failure analysis technique for high precision polishing at the wafer level. Using FIB, it is possible to precisely mill at a region of interest, capture images at the region of interest simultaneously and cut into the die directly to expose the exact failure without damaging other sections of the specimen.