scholarly journals Diamond Etching Beyond 10 μm with Near-Zero Micromasking

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Marie-Laure Hicks ◽  
Alexander C. Pakpour-Tabrizi ◽  
Richard B. Jackman
Keyword(s):  
Surface Roughness ◽  
Etch Rate ◽  
Chemical Resistance ◽  
High Quality ◽  
High Performing ◽  
Etched Surface

Abstract To exploit the exceptional properties of diamond, new high quality fabrication techniques are needed to produce high performing devices. Etching and patterning diamond to depths beyond one micron has proven challenging due to the hardness and chemical resistance of diamond. A new cyclic Ar/O2 - Ar/Cl2 ICP RIE process has been developed to address micromasking issues from the aluminium mask by optimising the proportion of O2 in the plasma and introducing a preferential “cleaning” step. High quality smooth features up to, but not limited to, 10.6 μm were produced with an average etched surface roughness of 0.47 nm at a diamond etch rate of 45 nm/min and 16.9:1 selectivity.

scholarly journals High-quality net shape geometries from additively manufactured parts using closed-loop controlled ablation with ultrashort laser pulses

2020 ◽  
Vol 9 (1-2) ◽  
pp. 101-110 ◽  
Author(s):  
Daniel Holder ◽  
Artur Leis ◽  
Matthias Buser ◽  
Rudolf Weber ◽  
Thomas Graf
Keyword(s):  
Surface Roughness ◽  
Closed Loop ◽  
High Surface ◽  
Laser Pulses ◽  
Ultrashort Laser Pulses ◽  
Minimum Thickness ◽  
High Quality ◽  
Surface Optical ◽  
The Individual ◽  
Ultrashort Laser

AbstractAdditively manufactured parts typically deviate to some extent from the targeted net shape and exhibit high surface roughness due to the size of the powder grains that determines the minimum thickness of the individual slices and due to partially molten powder grains adhering on the surface. Optical coherence tomography (OCT)-based measurements and closed-loop controlled ablation with ultrashort laser pulses were utilized for the precise positioning of the LPBF-generated aluminum parts and for post-processing by selective laser ablation of the excessive material. As a result, high-quality net shape geometries were achieved with surface roughness, and deviation from the targeted net shape geometry reduced by 67% and 63%, respectively.

Prediction of Surface Roughness in Compressed Air Jet Assisted High Speed End Milling of Silicon Using Diamond Coated Tools

2012 ◽  
Vol 576 ◽  
pp. 41-45
Author(s):  
A.K.M. Nurul Amin ◽  
M.A. Mahmud ◽  
M.D. Arif
Keyword(s):  
Mathematical Model ◽  
Surface Roughness ◽  
Surface Finish ◽  
High Speed ◽  
End Milling ◽  
Silicon Wafers ◽  
Compressed Air ◽  
Machining Parameters ◽  
High Quality ◽  
Ductile Mode

The majority of semiconductor devices are made up of silicon wafers. Manufacturing of high-quality silicon wafers includes numerous machining processes, including end milling. In order to end mill silicon to a nano-meteric surface finish, it is crucial to determine the effect of machining parameters, which influence the machining transition from brittle to ductile mode. Thus, this paper presents a novel experimental technique to study the effects of machining parameters in high speed end milling of silicon. The application of compressed air, in order to blow away the chips formed, is also investigated. The machining parameters’ ranges which facilitate the transition from brittle to ductile mode cutting as well as enable the attainment of high quality surface finish and integrity are identified. Mathematical model of the response parameter, the average surface roughness (Ra) is subsequently developed using RSM in terms of the machining parameters. The model was determined, by Analysis of Variance (ANOVA), to have a confidence level of 95%. The experimental results show that the developed mathematical model can effectively describe the performance indicators within the controlled limits of the factors that are being considered.

Small Holes Fabrication on Soda Glass by Self-Elastic Polycrystalline Diamond Tool

2012 ◽  
Vol 516 ◽  
pp. 516-521
Author(s):  
Chung Chieh Cheng ◽  
Dong Yea Sheu
Keyword(s):  
Surface Roughness ◽  
Diamond Tool ◽  
Polycrystalline Diamond ◽  
The Self ◽  
High Quality ◽  
Drilling Tool ◽  
Drilling Tools ◽  
Absorbing Materials ◽  
New Type ◽  
Small Holes

This study describes a novel process to drill small holes in brittle materials such as glass, silicon and ceramic using a self-elastic polycrystalline diamond (PCD) drilling tool. In order to improve the surface roughness and reduce crack of the small holes, a new type of self-elastic PCD drilling tool equipped with vibration absorbing materials inside the housing was developed to fabricate small holes in glass in this study. The self-elastic PCD drilling tools could absorb the mechanical force by the vibration absorbing materials while the PCD tool penetrates into the small holes. Compared to conventional PCD drilling tools, the experimental results show that high-quality small holes drilled in glass can be achieved with cracking as small as 0.02mm on the outlet surface using the self-elastic PCD drilling tool.

INVESTIGATION ON HIGH-TEMPERATURE OXIDIZATION OF MIRROR-QUALITY GROUND STAINLESS STEEL

2010 ◽  
Vol 24 (15n16) ◽  
pp. 3005-3010 ◽  
Author(s):  
KAZUTOSHI KATAHIRA ◽  
HITOSHI OHMORI ◽  
MASAYOSHI MIZUTANI ◽  
JUN KOMOTORI
Keyword(s):  
Surface Roughness ◽  
Stainless Steel ◽  
High Temperature ◽  
High Quality ◽  
Spinel Type ◽  
Combined Process ◽  
Elid Grinding ◽  
Modification Method ◽  
Quality Surface ◽  
High Quality Surface

To investigate the possibility of developing a new surface modification method by the combined process of ELID grinding and high-temperature oxidization, we treated ELID finished specimens and polished specimens by high-temperature oxidization in the atmosphere and performed detailed analysis to determine how the treatment would change the specimen surfaces. The ELID-series showed high quality surface roughness and excellent tribological characteristics as compared with the polished-series. The improved surface properties of the ELID-series seem to result from formation of fine, uniform structures of spinel-type multiple oxides FeCr 2 O 4 and Cr 2 O 3 on the surface by high-temperature oxidization.

scholarly journals STUDY OF EFFECT OF DIFFERENT ORIGIN PIGMENTS ON FRICTIONAL PROPERTIES OF POLYUREA GREASES

2018 ◽  
Vol 59 (7) ◽  
pp. 68
Author(s):  
Vladimir N. Koshelev ◽  
Boris P. Tonkonogov ◽  
Anastasia Yu. Kilyakova ◽  
Karine G. Aleksanyan ◽  
Eldar M. Movsumzade ◽  
...  
Keyword(s):  
Organic Compounds ◽  
Wide Temperature Range ◽  
Chemical Resistance ◽  
Important Task ◽  
High Quality ◽  
Urea Derivatives ◽  
Temperature Range ◽  
Frictional Properties ◽  
High Speeds ◽  
Different Origin

In connection with development of techniques and technologies and unification and substitution the most important task for Russia is to solve the problem of development and introduction of modern high-quality domestic greases. The most suitable in this respect is greases with the urea derivatives thickener — organic compounds containing in molecules one or more urea (urea, wreath) groups. In recent years, the production of these lubricants attracts increased attention of specialists, because they have unique exploitation characteristics: the combination of high-hydrolytic and chemical resistance, operability in a wide temperature range, thermo-strengthening lack, retention its properties at high speeds and specific loads, in contact with adverse environments, etc.  We received greases based on poly urea with the addition of pigment. The synthesized pigments have different structure and belong to different classes of compounds. We conducted a search for the most optimal structures and concentrations of pigments which are included in the poly urea grease.

Etch Rate and Surface Morphology of Plasma Etched Glass Substrates

2000 ◽  
Vol 657 ◽  
Author(s):  
Junting Liu ◽  
Nikolay I. Nemchuk ◽  
Dieter G. Ast ◽  
J. Gregory Couillard
Keyword(s):  
Plasma Etching ◽  
Glass Ceramic ◽  
Etch Rate ◽  
Glass Ceramics ◽  
Similar Rate ◽  
Optical Mems ◽  
Glass Substrates ◽  
Rate Limiting Step ◽  
Green Glass ◽  
Etched Surface

ABSTRACTMicro-machined transparent components are of interest for optical MEMS and miniaturized biological systems. The glass ceramic GC6 developed by Corning is optically transparent, has a softening point in excess of 900°C, and a thermal expansion coefficient matched to silicon. These properties make it useful for the construction of devices that combine thin film silicon electronics with MEMS systems.Both the ceramic precursor (green glass) and the glass ceramic etch at a similar rate, about 1/3 to 1/4 of that of SiO2 etched under the same conditions, indicating that chemistry rather than microstructure control the etch rate. The cleaning steps used to clean the glass precursor profoundly influence the degree of surface roughness that develops during subsequent plasma etching. In glass ceramics, the morphology of plasma etched surface is always very smooth and independent of the cleaning steps used. Assuming that the removal of spinel crystals is the rate limiting step in plasma etching glass ceramics can explain this observation.

Study on Dual-Plane Ball Polishing Method for Finishing Ceramics Ball

2013 ◽  
Vol 797 ◽  
pp. 444-449 ◽  
Author(s):  
Kai Ping Feng ◽  
Zhao Zhong Zhou ◽  
Bing Hai Lv ◽  
Ju Long Yuan
Keyword(s):  
Surface Roughness ◽  
Process Parameters ◽  
Mechanical Damage ◽  
Lower Plate ◽  
Mathematics Model ◽  
Polishing Process ◽  
High Quality ◽  
Dual Plane ◽  
Surface Polishing ◽  
Polishing Machine

This paper represents a dual-plane polishing method for ceramics ball. Compared with traditional ball polishing method, its upper and lower plate are all flat and easy to use soft pad to polish, so it can largely reduce the surface mechanical damage and obtain high quality processing surface. This paper analyzes surface polishing trajectory by calculation and simulation to test the polishing trajectory uniformity. A mathematics model of polishing process is established to disintegrate the process of a balls movement. Experiment is operated in dual-plane planetary polishing machine. The result shows that perfect polishing surface and spherical error can be obtained under the proper process parameters, the surface roughness achieves 4nm and the spherical error can reach 0.217μm.

Semiconductor Optoelectronic Device Fabrication Using Dry Etching

1988 ◽  
Vol 144 ◽  
Author(s):  
Adam J. Carter ◽  
Ben Thomas ◽  
David V. Morgan ◽  
Jyoti K. Bhardwaj
Keyword(s):  
Surface Roughness ◽  
Plasma Etching ◽  
Surface Characteristics ◽  
Optoelectronic Device ◽  
Dry Etching ◽  
Device Fabrication ◽  
Material Composition ◽  
Process Gas ◽  
Etched Surface

ABSTRACTPlasma etching of GaAs and InP using a CH4/H2 process gas and AlxGa1−xAs using a SiCl4 plasma are reported. Particular attention to etching characteristics as a function of gas and material composition, r.f. power, pressure and temperature are shown. Etching of GaAs and InP highlight two separate etching mechanisms. Surface roughness data at the etched surface is presented and Cl and CH4/H2 process chemistries are compared which shows the latter to yield significant improvements in etch surface characteristics.

Novel Mocvd Processes for Nanoscale Oxide Thin Films

1996 ◽  
Vol 446 ◽  
Author(s):  
Tingkai Li ◽  
Pete Zawadzkp ◽  
Richard A. Stall ◽  
Yongfei Zhu ◽  
Seshu B. Desu
Keyword(s):  
Thin Films ◽  
Surface Roughness ◽  
Integrated Circuits ◽  
Deposition Temperature ◽  
High Dielectric Constant ◽  
Ferroelectric Properties ◽  
Oxide Thin Films ◽  
High Quality ◽  
Step Process ◽  
High Dielectric

AbstractNanoscale oxide thin films such as Ba1‐xSrxTiO3 (BST), SrBi2Ta2O9 (SBT), and PbZr1‐xTixO3 (PZT) that have a high dielectric constant and excellent ferroelectric properties have been receiving greatly increased attention, especially for high density memories in next generation integrated circuits. However, with increasing deposition temperature the surface roughness of the films increases, which results in high leakage current, and when the thickness of oxide films is decreased, the apparent bulk‐like properties of thin films tend to worsen due to the increased influence of the interface. To solve these problems, novel MOCVD techniques, plasma enhanced deposition, and a two step process, were developed for high quality oxide thin films.

Experimental research on the deep-hole boring of pure niobium tube

2020 ◽  
Vol 234 (8) ◽  
pp. 1124-1132
Author(s):  
Xiaolan Han ◽  
Zhanfeng Liu ◽  
Yazhou Feng
Keyword(s):  
Surface Roughness ◽  
Tool Wear ◽  
Experimental Research ◽  
Process Parameters ◽  
Cutting Tool ◽  
Geometric Parameters ◽  
Deep Hole ◽  
High Quality ◽  
Pure Niobium ◽  
Hole Axis

In the deep-hole boring process on pure niobium tube, there exist some problems including serious tool wear, tough chips, and poor surface quality. In order to bore high-quality deep holes on rolled niobium tube, the cutting tool structure and boring process parameters suitable for machining rolled niobium tube were designed and two experimental schemes were proposed. The results showed that the geometric parameters of the cutting tool and process parameters have important influences on the tool wear, chip morphologies, hole-axis deflection, and hole surface roughness. By adjusting the geometric parameters of the cutting tool and boring process parameters, reasonable geometric parameters of the cutting tool and boring process parameters were obtained.

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