A Study of Tri-Axial Fluxgate Magnetometer

2012 ◽  
Vol 263-266 ◽  
pp. 69-75
Author(s):  
Yue Zhang ◽  
Chen Xiao Cao
Keyword(s):  
High Temperature ◽  
Silicon On Insulator ◽  
Fluxgate Magnetometer ◽  
Test Results ◽  
Original Design ◽  
Technical Specifications ◽  
Result Analysis ◽  
Development Tendency ◽  
Hybrid Circuit ◽  
Better Than

This paper is devoted to study tri-axial fluxgate magnetometer, and it begin with principle of fluxgate magnetometer, and then its structure, electric design and test result analysis are introduced. At present, its development tendency is to simplify and miniaturize, we carried out study of tri-axial fluxgate magnetometer. Its technical specifications such as resolution, noise, response of step up, setting up time and sensitivity meet or even better than original design requirements. At first design of tri-axial fluxgate magnetometer is determined and a transducer is developed. Secondly, a high temperature circuit is developed with SOI (Silicon on Insulator) electronics wafer and hybrid circuit technology. At last, 5 specifications test results are presented from aspects of high temperature and high accuracies, respectively.

4–20mA optical sensor at 300C using SiC and SOI integrated circuits

2021 ◽  
Vol 2021 (HiTEC) ◽  
pp. 000008-000012
Author(s):  
Cheng-Po Chen ◽  
Emad Andarawis
Keyword(s):  
Silicon Carbide ◽  
High Temperature ◽  
Integrated Circuits ◽  
Optical Sensor ◽  
Room Temperature ◽  
Silicon On Insulator ◽  
Test Results ◽  
Compression Technique ◽  
Gain Compression ◽  
Hybrid Circuit

Abstract GE is reporting test results from a hybrid circuit using high temperature capable resistors, capacitors, silicon carbide devices and silicon-on-insulator integrated circuits. The sensing circuit converts photodiode current to an industrial standard 4 to 20 mA output using a two wire configuration. Input currents at levels from 0pA to 30nA is converted to 4 to 20 mA using a gain compression technique and tested from room temperature to 300°C. Further, we show the circuit operating at 300°C for more than 2000 hours without failure.

High Temperature Analog-to-Digital Converter Reliability Testing

2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000245-000252 ◽  
Author(s):  
Bruce W. Ohme ◽  
Mark R. Larson
Keyword(s):  
High Temperature ◽  
Silicon On Insulator ◽  
Cmos Process ◽  
Reliability Testing ◽  
Test Results ◽  
Analog To Digital Converter ◽  
Digital Converter ◽  
Life Test ◽  
Analog To Digital ◽  
Post Stress

Initial test results have been previously reported for a high-temperature (225°C) 12-bit analog-to-digital converter (HTADC12) fabricated using a production high-temperature silicon-on-insulator (SOI) CMOS process and assembled in hermetically sealed ceramic packages (ref. 1). Reliability test results for the HTADC12 are presented including parametric and functional test results from 1500 hours of dynamic life test at 250°C as well 1000 temperature cycles from −65°C to 200°C. Results of post-stress wirebond, and die bond testing are also provided.

Lifetime and Failure Modes of High Temperature SOI Products

2018 ◽  
Vol 2018 (HiTEC) ◽  
pp. 000112-000115 ◽  
Author(s):  
Derek Maxwell ◽  
Marshall Soares ◽  
Matt Coreless
Keyword(s):  
High Temperature ◽  
Failure Modes ◽  
Extreme Temperature ◽  
Silicon On Insulator ◽  
Accelerated Testing ◽  
Test Results ◽  
Life Test ◽  
Tungsten Metal

Abstract RelChip has performed life test studies on its RAM and has shown that Silicon On Insulator (SOI) processing with Aluminum-Tungsten metal traces can operate for over 4000 hours at 350°C and do not fail due to electromigration. Three parts were randomly selected and functionally tested at the extreme temperature using accelerated testing (HAST). The parts were pulled periodically for in-depth testing and examination. Test results indicate failures are due to device failures, and not electromigration.

High Temperature 256Kbit (32Kbit × 8) HTEEPROM Reliability Testing

2013 ◽  
Vol 2013 (HITEN) ◽  
pp. 000105-000115
Author(s):  
Joe G. Guimont ◽  
Bruce W. Ohme
Keyword(s):  
High Temperature ◽  
Gas Analysis ◽  
Silicon On Insulator ◽  
Reliability Test ◽  
Cmos Process ◽  
Control Input ◽  
Test Results ◽  
Data Retention ◽  
Parallel Memory ◽  
Non Volatile Memory

Results of reliability and qualification testing are presented for a commercial High Temperature EEPROM (HTEEPROM). This HTEEPROM is specified for operation at 225°C and is the highest temperature rated commercial non-volatile memory available to date. Initial test results (at 250°C) and design details have been previously reported for a prototype 256Kbit (32Kbit × 8) HTEEPROM fabricated using a production high-temperature silicon-on-insulator (SOI) 0.8 micron CMOS process [1]. This paper presents reliability test results for a commercial version developed using knowledge gained from the previously reported HTEEPROM, and fabricated in the same technology. The reliability test results include data retention at 250°C, endurance (write cycling) > 100,000 cycles, parametric and functional test results for 1000 hours of dynamic life test at 250°C, 100 temperature cycles from −65°C to 200°C, ESD, Group D and residual-gas-analysis (RGA) testing. The HTEEPROM is packaged in a 56-pin ceramic pin-grid-array (PGA) package. It is configurable by a control input pin for either serial or parallel memory access. The design incorporates an on-chip timer to support periodic memory refresh to extend data retention indefinitely.

scholarly journals High-Performance Compact Multi-Mode UWB Filter using High-Temperature Superconductivity

Electronics ◽  
2019 ◽  
Vol 8 (12) ◽  
pp. 1473
Author(s):  
Liguo Zhou ◽  
Zhihe Long ◽  
Hang Wu ◽  
Hui Li ◽  
Tianliang Zhang
Keyword(s):  
High Temperature ◽  
Insertion Loss ◽  
High Performance ◽  
High Temperature Superconductivity ◽  
Wide Band ◽  
Test Results ◽  
Multi Mode ◽  
Mode Resonator ◽  
Better Than ◽  
Good Agreement

A high-performance miniaturized multi-mode ultra-wide band (UWB) filter is proposed in this paper. The simple compact quintuple-mode resonator is constructed by loading three sets of open stubs on a modified conventional triple-mode resonator. Even and odd mode analytical methods are applied to analyze it. In addition, the function of each part of the filter is studied in cases of weak/strong coupling. In order to further improve the insertion loss, selectivity and out-of-band suppression, the designed filter is finally fabricated on double-sided YBCO/MgO/YBCO high-temperature superconducting (HTS) film. The test results show that the HTS UWB filter has excellent performance, and the simulation results are in good agreement with the test ones. The 3-dB bandwidth covers 3.6 ~ 13.2 GHz. The maximum insertion loss in the band was only 0.32 dB, and the reflection was better than –15.1 dB. The band-edge roll-off rate was 56 dB/GHz and the upper stopband with 20 dB rejection extended to 20.7 GHz.

Defect reduction in oxygen implanted silicon-on-insulator material during high-temperature annealing

1989 ◽  
Vol 47 ◽  
pp. 604-605
Author(s):  
P. Roitman ◽  
B. Cordts ◽  
S. Visitserngtrakul ◽  
S.J. Krause
Keyword(s):  
High Temperature ◽  
Annealing Temperature ◽  
Silicon On Insulator ◽  
High Dose ◽  
High Temperature Annealing ◽  
High Current ◽  
Defect Reduction ◽  
Annealing Step ◽  
Multiple Cycle ◽  
Defect Densities

Synthesis of a thin, buried dielectric layer to form a silicon-on-insulator (SOI) material by high dose oxygen implantation (SIMOX – Separation by IMplanted Oxygen) is becoming an important technology due to the advent of high current (200 mA) oxygen implanters. Recently, reductions in defect densities from 109 cm−2 down to 107 cm−2 or less have been reported. They were achieved with a final high temperature annealing step (1300°C – 1400°C) in conjunction with: a) high temperature implantation or; b) channeling implantation or; c) multiple cycle implantation. However, the processes and conditions for reduction and elimination of precipitates and defects during high temperature annealing are not well understood. In this work we have studied the effect of annealing temperature on defect and precipitate reduction for SIMOX samples which were processed first with high temperature, high current implantation followed by high temperature annealing.

Implementasi Voip Server Berbasis IPV6 Dengan Raspberry PI

2019 ◽  
Vol 9 (01) ◽  
pp. 47-54
Author(s):  
Rabbai San Arif ◽  
Yuli Fitrisia ◽  
Agus Urip Ari Wibowo
Keyword(s):  
Internet Protocol ◽  
Wireless Transmission ◽  
Raspberry Pi ◽  
Test Results ◽  
Average Delay ◽  
Ipv6 Network ◽  
Ip Network ◽  
Selection Of ◽  
Better Than

Voice over Internet Protocol (VoIP) is a telecommunications technology that is able to pass the communication service in Internet Protocol networks so as to allow communicating between users in an IP network. However VoIP technology still has weakness in the Quality of Service (QoS). VOPI weaknesses is affected by the selection of the physical servers used. In this research, VoIP is configured on Linux operating system with Asterisk as VoIP application server and integrated on a Raspberry Pi by using wired and wireless network as the transmission medium. Because of depletion of IPv4 capacity that can be used on the network, it needs to be applied to VoIP system using the IPv6 network protocol with supports devices. The test results by using a wired transmission medium that has obtained are the average delay is 117.851 ms, jitter is 5.796 ms, packet loss is 0.38%, throughput is 962.861 kbps, 8.33% of CPU usage and 59.33% of memory usage. The analysis shows that the wired transmission media is better than the wireless transmission media and wireless-wired.

URANUS 52N

Alloy Digest ◽  
1994 ◽  
Vol 43 (5) ◽  
Keyword(s):  
Stainless Steel ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Flue Gas ◽  
Crevice Corrosion ◽  
Heat Treating ◽  
Flue Gas Desulfurization ◽  
Temperature Performance ◽  
Aisi Type ◽  
Better Than

Abstract URANUS 52N is a nitrogen-alloyed duplex stainless steel improved in stress-corrosion cracking resistance and with pitting and crevice corrosion resistance better than AISI Type 317L. Applications include handling phosphoric acid contaminated with chlorides and in flue gas desulfurization scrubbers. This datasheet provides information on composition, physical properties, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, and joining. Filing Code: SS-566. Producer or source: Creusot-Marrel.

Kemampuan Komunikasi Matematika: Studi Komparasi Pembelajaran Number Head Together (NHT) dan Media Power Point (PPT)

2020 ◽  
Vol 3 (1) ◽  
pp. 39-50
Author(s):  
Bernadeta Ritawati ◽  
Sri Wahyuni
Keyword(s):  
Communication Skills ◽  
Hypothesis Test ◽  
Test Results ◽  
Mathematical Communication ◽  
Cluster Technique ◽  
Significance Level ◽  
Quasi Experimental ◽  
Power Point ◽  
Media Power ◽  
Better Than

This research is a quasi-experimental study that aims to determine the comparison of students' mathematical communication abilities with the cooperative learning model of the NHT and PPT media in class VII SMP Negeri 02 Ngabang. The population in this study were all students of class VII SMP 02 Ngabang consisting of 3 classes. The sample in this study was taken by using the Random Sampling Cluster technique. Class VII A as class I experimental class with 24 students and class VII B as a experimental class II with 24 students. The instruments used were pretest and posttest in the form of description. Data analysis uses the t test with a significance level of 5%. The results showed the average posttest for the NHT class was 72.5 and the average posttest for the PP class was 66.666. From the posttest hypothesis test results obtained t hitung> t tabel (1.9522> 1,667). Because t_hitung> t_tabel, H_0 is rejected and H_a is accepted. This means that students' mathematical communication skills taught with the NHT are better than using Power point media.

scholarly journals Evaluation of the Feasibility of NaCaPO4-Blended Zirconia as a New CAD/CAM Material for Dental Restoration

Materials ◽  
2021 ◽  
Vol 14 (14) ◽  
pp. 3819
Author(s):  
Ting-Hsun Lan ◽  
Yu-Feng Chen ◽  
Yen-Yun Wang ◽  
Mitch M. C. Chou
Keyword(s):  
Computer Aided Design ◽  
Optical Microscope ◽  
Dental Restoration ◽  
Numerical Control ◽  
Test Results ◽  
Cnc Machine ◽  
Computer Aided ◽  
Cad Cam ◽  
Aided Design ◽  
Better Than

The computer-aided design/computer-aided manufacturing (CAD/CAM) fabrication technique has become one of the hottest topics in the dental field. This technology can be applied to fixed partial dentures, removable dentures, and implant prostheses. This study aimed to evaluate the feasibility of NaCaPO4-blended zirconia as a new CAD/CAM material. Eleven different proportional samples of zirconia and NaCaPO4 (xZyN) were prepared and characterized by X-ray diffractometry (XRD) and Vickers microhardness, and the milling property of these new samples was tested via a digital optical microscope. After calcination at 950 °C for 4 h, XRD results showed that the intensity of tetragonal ZrO2 gradually decreased with an increase in the content of NaCaPO4. Furthermore, with the increase in NaCaPO4 content, the sintering became more obvious, which improved the densification of the sintered body and reduced its porosity. Specimens went through milling by a computer numerical control (CNC) machine, and the marginal integrity revealed that being sintered at 1350 °C was better than being sintered at 950 °C. Moreover, 7Z3N showed better marginal fit than that of 6Z4N among thirty-six samples when sintered at 1350 °C (p < 0.05). The milling test results revealed that 7Z3N could be a new CAD/CAM material for dental restoration use in the future.

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