scholarly journals TIQ Flash ADC Design using a Low Power Multiplier Based Encoder

Threshold Inverter Quantization (TIQ) for applications of system-on-chip (SoC) depending on CMOS flash analog-to-digital converter (ADC). The TIQ technique which uses two cascaded CMOS inverters as a voltage comparator. However, this TIQ method must be created to meet the latest SoC trends, which force ADCs to be integrated with another electronic circuit on the chip and focus on low-power and low-voltage applications. TIQ comparator reduced the impact of variations in the process, temperature, and power supply voltage. Therefore, we obtained a higher TIQ flash ADC speed and resolution. TIQ flash ADC reduced / managed power dissipation. We obtain large power savings by managing the power dissipation in the comparator. Furthermore, the new comparator has a huge benefit in power dissipation and noise rejection comparative to the TIQ comparator [1]. The findings indicate that the TIQ flash ADC based on Modied mux attain heavy-speed transformation and has a tiny size, low-power dissipation and operation of lowvoltage compared to another flash ADCs.

The evaluation of many comparator outcomes for the given requirement having excessive velocity using analog to digital converters is growing, this are controlled using CMOS comparators which are successful when delivering the low voltage with high efficiency. The comparators are primary part of numerous simple to computerized converters. The prerequisite for low-control, rapid simple to advanced converters is increasing. Thus comparators are generally utilized in the present innovation because of its quick operational speed and high precision. The quickly developing versatile gadget requires low power and high operational capacities which should be improved. A concise investigation of traditional double tail voltage comparator is done and dependent on that, a low power and region productive comparator is displayed. Another comparator is planned so as to decrease the postponement of ordinary comparators and diminish the power utilization of the gadget. Furthermore, the Reproduction is finished by Leather Treated Simple Plan Condition. At last we study about conventional dual tail voltage comparator which is done based on low power and area efficient comparator. In this simulation of proposed comparator is occurs a 180nm CMOS technology its consumes the power of 69µW at 1.2v Ac power supply voltage.


Author(s):  
P.A. Gowri Sankar ◽  
G. Sathiyabama

The continuous scaling down of metal-oxide-semiconductor field effect transistors (MOSFETs) led to the considerable impact in the analog-digital mixed signal integrated circuit design for system-on-chips (SoCs) application. SoCs trends force ADCs to be integrated on the chip with other digital circuits. These trends present new challenges in ADC circuit design based on existing CMOS technology. In this paper, we have designed and analyzed a 3-bit high speed, low-voltage and low-power flash ADC at 32nm CNFET technology for SoC applications. The proposed ADC utilizes the Threshold Inverter Quantization (TIQ) technique that uses two cascaded carbon nanotube field effect transistor (CNFET) inverters as a comparator. The TIQ technique proposed has been developed for better implementation in SoC applications. The performance of the proposed ADC is studied using two different types of encoders such as ROM and Fat tree encoders. The proposed ADCs circuits are simulated using Synopsys HSPICE with standard 32nm CNFET model at 0.9 input supply voltage. The simulation results show that the proposed 3 bit TIQ technique based flash ADC with fat tree encoder operates up to 8 giga samples per second (GSPS) with 35.88µW power consumption. From the simulation results, we observed that the proposed TIQ flash ADC achieves high speed, small size, low power consumption, and low voltage operation compared to other low power CMOS technology based flash ADCs. The proposed method is sensitive to process, temperature and power supply voltage variations and their impact on the ADC performance is also investigated.


2018 ◽  
Vol 27 (10) ◽  
pp. 1850155 ◽  
Author(s):  
Jie Jin ◽  
LV Zhao

A low voltage low power fully integrated chaos generator is presented in this paper. Comparing with the conventional off-the-shelf electronic components-based chaos generators, the designed circuit is fully integrated, and it achieves lower supply voltage, lower power dissipation and smaller chip area. The proposed fully integrated chaos generator is verified with GlobalFoundries 0.18[Formula: see text][Formula: see text]m CMOS 1P6M RF process using Cadence IC Design Tools. The simulation results demonstrate that the fully integrated chaos generator consumes only 17[Formula: see text]mW from [Formula: see text]2.5[Formula: see text]V supply voltage. Moreover, the chip area of the chaos generator is only 1.755[Formula: see text]mm2 including the testing pads, and it has a wide range of practical application prospects.


Author(s):  
Lokesh S

The dominant portion of power dissipation in CMOS adder circuits, due to logic transitions, varies as the square of the supply, significant savings in power dissipation may be exacted by operating with reduced supply voltage. If the supply voltage is reduced while threshold voltage stays same, the noise margins will reduce. Addition is a crucial process because it usually involve carry ripple steps which must propagate a carry signal from each bit to it’s higher bit position. This results in a substantial circuit delay. The adder which lies in the crucial delay path will effectively determine the system overall speed. To improve noise margins, the threshold voltages must also be made smaller. However subthreshold leakage current increases exponentially when threshold voltage is reduced. The higher static dissipation may then offset the reduction in transitions portion of the dissipation. Hence the devices needed to have threshold voltages that maximizes the net reduction in the dissipation. Addition is an obligatory operation that is crucial to processing the fundamental arithmetic operations. Due to the potential versatility of adders in this contemporary research field, the existing adders and adder designs currently intended for future low voltage and low power environments. This can be achieved by the CMOS adders namely Parallel Adder, Ripple Carry Adder(RCA), Carry Look Ahead Adder(CLA), Carry Select Adder(CSL), Carry Save Adder(CSA), Carry Skip Adder(CSK), Conditional Sum Adder(COS).


2019 ◽  
Vol 15 (4) ◽  
pp. 368-378 ◽  
Author(s):  
Mounira Bchir ◽  
Thouraya Ettaghzouti ◽  
Néjib Hassen

This paper introduces a novel structure for the realization of a low voltage, low power current-mode analog to the digital converter (ADC) pipeline (12 bits). The proposed structure of the ADC is based on a novel design of a current comparator and Digital to Analog Converter (DAC) structure. This modification allows us to reach a higher speed, lower voltage, and lower power dissipation. ELDO simulators using 0.18 μm, CMOS and TSMC parameters are performed to confirm the workability of this architecture. The proposed ADC is powered with a 1 V supply voltage. It is characterized by wide conversion frequency (350 MHz) and low power consumption that is 2.76 mW.


2013 ◽  
Vol 22 (08) ◽  
pp. 1350074 ◽  
Author(s):  
SARA NESHANI ◽  
SEYED JAVAD AZHARI

In this work, a 6-bit 1.33 GS/s flash analog-to-digital converter (ADC) is proposed. To noticeably save the power and area and greatly increase the speed, compactness and accuracy its complete structure is elaborately implemented in MOS Current Mode Logic (MCML) topology. The proposed ADC does not use a front-end track and hold (T/H) block either. Furthermore, a novel optimized resistance ratio averaging-interpolation scheme is applied to: (1) reduce the offset, nonlinearity, number of preamplifiers, area and the power (2) increase the accuracy and mismatch insensitivity (3) minimize the size of elements towards the more compact size, smaller area and higher speed for the ADC. To maximize all these achievements, most favorably, it is completely built by NMOS transistors realizing the ever desired unique NMCML (NMOS-MCML) structure. Using intermediate gray encoding and exponential gains by extra latches greatly removes the bubble/meta-stability error and increases both the speed and the accuracy. Utilizing a differential ladder and some other deliberate arrangements reduces the kickback noise and common mode interferences, minimizes the structure and facilitates fast recovery of overdrive signals. The proposed ADC is simulated by Hspice using 0.18 μm TSMC technology and shows; effective resolution band width (ERBW) larger than 903 MHz that is 1.36 times more than Nyquist frequency (fs/2), 35.17 dB/49.4 dB SNDR/SFDR, 5.53 bits ENOB (rather flat SNDR and ENOB from 50 MHz to 750 MHz), and the low power consumption of 37.77 mW from a 1.2 V supply. These results prove that applying so many effective and novel plans has obtained a unique all N-MCML flash ADC with power-efficiency of 0.61 pJ per conversion step. Both Monte Carlo and corner cases simulations in addition to temperature analysis are performed that prove both intra-die and inter-die robustness of the proposed structure.


2019 ◽  
Vol 8 (4) ◽  
pp. 10650-10653

The main aim of electronics is to design low power devices due to the prevalent usage of powered gadget. Ultra low voltage operation of memory cells has become a subject of a lot of interest because of its applications in terribly low energy computing. The stable operation of static random access memory (SRAM) is important for the success of low voltage SRAM and it is achieved by parameter variations of scaled technologies. The power consumption and access time of the SRAM is also a complex parameter due to the unavoidable switching activities of the number of transistors used for different blocks like, SRAM cell, access transistors, pre-charge circuit, sense amplifier and decoders. It has been shown that conventional 6T SRAM fail to achieve low power and delay operation. The proposed 10T SRAM design gives an approach towards the hold power dissipation. The designed circuit has 10 transistors out of that 2 transistors are used as sleep transistor. The sleep transistors are used as switches. Such as header and footer switches and the switches are turned on during active mode of operations and turned off during idle or standby mode of operations. The designed SRAM cell also has conducting pMOS circuit, which can reduces the total power dissipation. The SRAM cell is simulated by using Cadence tool. A supply voltage of 1.8V is used which makes it enough for low power applications. The power obtained as 761.7mW, which reduces 15% of conventional 6T SRAM design. The delay obtained as 125.6ns, which reduces 45% of conventional 6T SRAM.


1993 ◽  
Vol 29 (15) ◽  
pp. 1324 ◽  
Author(s):  
L.E. Larson ◽  
M.M. Matloubian ◽  
J.J. Brown ◽  
A.S. Brown ◽  
M. Thompson ◽  
...  

2014 ◽  
Vol 23 (08) ◽  
pp. 1450108 ◽  
Author(s):  
VANDANA NIRANJAN ◽  
ASHWANI KUMAR ◽  
SHAIL BALA JAIN

In this work, a new composite transistor cell using dynamic body bias technique is proposed. This cell is based on self cascode topology. The key attractive feature of the proposed cell is that body effect is utilized to realize asymmetric threshold voltage self cascode structure. The proposed cell has nearly four times higher output impedance than its conventional version. Dynamic body bias technique increases the intrinsic gain of the proposed cell by 11.17 dB. Analytical formulation for output impedance and intrinsic gain parameters of the proposed cell has been derived using small signal analysis. The proposed cell can operate at low power supply voltage of 1 V and consumes merely 43.1 nW. PSpice simulation results using 180 nm CMOS technology from Taiwan Semiconductor Manufacturing Company (TSMC) are included to prove the unique results. The proposed cell could constitute an efficient analog Very Large Scale Integration (VLSI) cell library in the design of high gain analog integrated circuits and is particularly interesting for biomedical and instrumentation applications requiring low-voltage low-power operation capability where the processing signal frequency is very low.


2021 ◽  
Vol 11 (2) ◽  
pp. 19
Author(s):  
Francesco Centurelli ◽  
Riccardo Della Sala ◽  
Pietro Monsurrò ◽  
Giuseppe Scotti ◽  
Alessandro Trifiletti

In this paper, we present a novel operational transconductance amplifier (OTA) topology based on a dual-path body-driven input stage that exploits a body-driven current mirror-active load and targets ultra-low-power (ULP) and ultra-low-voltage (ULV) applications, such as IoT or biomedical devices. The proposed OTA exhibits only one high-impedance node, and can therefore be compensated at the output stage, thus not requiring Miller compensation. The input stage ensures rail-to-rail input common-mode range, whereas the gate-driven output stage ensures both a high open-loop gain and an enhanced slew rate. The proposed amplifier was designed in an STMicroelectronics 130 nm CMOS process with a nominal supply voltage of only 0.3 V, and it achieved very good values for both the small-signal and large-signal Figures of Merit. Extensive PVT (process, supply voltage, and temperature) and mismatch simulations are reported to prove the robustness of the proposed amplifier.


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